Fabrication of a Bi2Te3-Based Thermoelectric Module Using Tin Electroplating and Thermocompression Bonding.

Yoon, Jongchan; Bae, Sung Hwa; Sohn, Ho-Sang; Son, Injoon; Park, KwanHo; Cho, Sanghum; Kim, Kyung Tae

Yoon, Jongchan; Bae, Sung Hwa; Sohn, Ho-Sang; Son, Injoon; Park, KwanHo; Cho, Sanghum; Kim, Kyung Tae.

Afiliación

Yoon J; School of Materials Science and Engineering, Kyungpook National University, 80 Daehakro, Buk-gu, Daegu 41566, Korea.
Bae SH; School of Materials Science and Engineering, Kyungpook National University, 80 Daehakro, Buk-gu, Daegu 41566, Korea.
Sohn HS; School of Materials Science and Engineering, Kyungpook National University, 80 Daehakro, Buk-gu, Daegu 41566, Korea.
Son I; School of Materials Science and Engineering, Kyungpook National University, 80 Daehakro, Buk-gu, Daegu 41566, Korea.
Park K; Technical Research Center, DAE YANG Co., Ltd., 46-17 Seongseogongdan-ro, Dalseo-gu, Daegu 42716, Korea.
Cho S; Technical Research Center, DAE YANG Co., Ltd., 46-17 Seongseogongdan-ro, Dalseo-gu, Daegu 42716, Korea.
Kim KT; Powder and Ceramic Materials Division, Korea Institute of Materials Science, 797 Chanwon-daero, Seongsan-gu, Changwon, Gyeongnam 51508, Korea.

J Nanosci Nanotechnol ; 19(3): 1738-1742, 2019 Mar 01.

Article en En | MEDLINE | ID: mdl-30469257

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: J Nanosci Nanotechnol Año: 2019 Tipo del documento: Article