Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu.

Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K N; Chen, Chih

Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K N; Chen, Chih.

Afiliación

Juang JY; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan. david.mse03g@g2.nctu.edu.tw.
Lu CL; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan. chialing.mse96g@g2.nctu.edu.tw.
Li YJ; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan. r777719982003@yahoo.com.tw.
Tu KN; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan. kntu@ucla.edu.
Chen C; Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095, USA. kntu@ucla.edu.

Materials (Basel) ; 11(12)2018 Nov 25.

Article en En | MEDLINE | ID: mdl-30477274

Palabras clave

Cu-to-Cu direct bonding; grain growth; nanotwinned Cu; shear strength; surface diffusion

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2018 Tipo del documento: Article País de afiliación: Taiwán Pais de publicación: Suiza

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