Low angle boundary migration of shot-peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction.

Oh, Jin-Su; Cha, Hyun-Woo; Kim, Tae-Hoon; Shin, Keesam; Yang, Cheol-Woong

Oh, Jin-Su; Cha, Hyun-Woo; Kim, Tae-Hoon; Shin, Keesam; Yang, Cheol-Woong.

Afiliación

Oh JS; School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea.
Cha HW; School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea.
Kim TH; Ames Laboratory, U.S. Department of Energy, Ames, Iowa.
Shin K; School of Nano and Advanced Materials Engineering, Changwon National University, Changwon, South Korea.
Yang CW; School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea.

Microsc Res Tech ; 82(6): 849-855, 2019 Jun.

Article en En | MEDLINE | ID: mdl-30689247

Palabras clave

electron backscatter diffraction (EBSD); electron channeling contrast imaging (ECCI); low angle boundary migration; scanning electron microscopy (SEM); stored energy

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Microsc Res Tech Asunto de la revista: DIAGNOSTICO POR IMAGEM Año: 2019 Tipo del documento: Article País de afiliación: Corea del Sur Pais de publicación: Estados Unidos

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