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Publisher Correction: Large-area MRI-compatible epidermal electronic interfaces for prosthetic control and cognitive monitoring.
Tian, Limei; Zimmerman, Benjamin; Akhtar, Aadeel; Yu, Ki Jun; Moore, Matthew; Wu, Jian; Larsen, Ryan J; Lee, Jung Woo; Li, Jinghua; Liu, Yuhao; Metzger, Brian; Qu, Subing; Guo, Xiaogang; Mathewson, Kyle E; Fan, Jonathan A; Cornman, Jesse; Fatina, Michael; Xie, Zhaoqian; Ma, Yinji; Zhang, Jue; Zhang, Yihui; Dolcos, Florin; Fabiani, Monica; Gratton, Gabriele; Bretl, Timothy; Hargrove, Levi J; Braun, Paul V; Huang, Yonggang; Rogers, John A.
Afiliación
  • Tian L; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA.
  • Zimmerman B; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Akhtar A; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Yu KJ; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Moore M; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea.
  • Wu J; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Larsen RJ; Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
  • Lee JW; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Li J; Department of Materials Science and Engineering, Pusan National University, Busan, Republic of Korea.
  • Liu Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Metzger B; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Qu S; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Guo X; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Mathewson KE; Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
  • Fan JA; Department of Psychology, University of Alberta, Edmonton, Alberta, Canada.
  • Cornman J; Department of Electrical Engineering, Stanford University, Stanford, CA, USA.
  • Fatina M; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Xie Z; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Ma Y; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Zhang J; Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
  • Zhang Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Dolcos F; Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
  • Fabiani M; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Gratton G; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Bretl T; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Hargrove LJ; Department of Aerospace Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Braun PV; Feinberg School of Medicine, Northwestern University, Shirley Ryan AbilityLab, Chicago, IL, USA.
  • Huang Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Rogers JA; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Nat Biomed Eng ; 3(4): 328, 2019 Apr.
Article en En | MEDLINE | ID: mdl-30952981
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Biomed Eng Año: 2019 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Biomed Eng Año: 2019 Tipo del documento: Article País de afiliación: Estados Unidos