Author Correction: Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder.

Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; He, Siliang; Nishikawa, Hiroshi

Author Correction: Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder.

Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; He, Siliang; Nishikawa, Hiroshi.

Afiliación

Shen YA; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 567-0047, Osaka, Japan. yashen@jwri.osaka-u.ac.jp.
Lin CM; Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu, 30401, Taiwan.
Li J; Department of Aviation Mechanical Engineering, China University of Science and Technology, Hsinchu, 312, Taiwan.
He S; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 567-0047, Osaka, Japan.
Nishikawa H; Department of electronic engineering, City University of Hong Kong, Hong Kong, SAR, China.

Sci Rep ; 10(1): 12229, 2020 Jul 22.

Article en En | MEDLINE | ID: mdl-32699303

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Rep Año: 2020 Tipo del documento: Article País de afiliación: Japón Pais de publicación: Reino Unido

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