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Wireless, skin-interfaced sensors for compression therapy.
Park, Yoonseok; Kwon, Kyeongha; Kwak, Sung Soo; Yang, Da Som; Kwak, Jean Won; Luan, Haiwen; Chung, Ted S; Chun, Keum San; Kim, Jong Uk; Jang, Hokyung; Ryu, Hanjun; Jeong, Hyoyoung; Won, Sang Min; Kang, Youn J; Zhang, Michael; Pontes, David; Kampmeier, Brianna R; Seo, Seon Hee; Zhao, Jeffrey; Jung, Inhwa; Huang, Yonggang; Xu, Shuai; Rogers, John A.
Afiliación
  • Park Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Kwon K; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Kwak SS; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea.
  • Yang DS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Kwak JW; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Luan H; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.
  • Chung TS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Chun KS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Jang H; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Ryu H; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Won SM; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Kang YJ; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Zhang M; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Pontes D; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Kampmeier BR; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Seo SH; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Zhao J; Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX 78712, USA.
  • Jung I; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Huang Y; School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.
  • Xu S; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA.
  • Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
Sci Adv ; 6(49)2020 12.
Article en En | MEDLINE | ID: mdl-33277263
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2020 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2020 Tipo del documento: Article País de afiliación: Estados Unidos