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3D Deep Learning Enables Accurate Layer Mapping of 2D Materials.
Dong, Xingchen; Li, Hongwei; Jiang, Zhutong; Grünleitner, Theresa; Güler, Inci; Dong, Jie; Wang, Kun; Köhler, Michael H; Jakobi, Martin; Menze, Bjoern H; Yetisen, Ali K; Sharp, Ian D; Stier, Andreas V; Finley, Jonathan J; Koch, Alexander W.
Afiliación
  • Dong X; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Li H; Department of Computer Science, Technical University of Munich, 85748 Garching, Germany.
  • Jiang Z; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Grünleitner T; Walter Schottky Institut and Physik Department, Technische Universität München, Am Coulombwall 4, 85748 Garching, Germany.
  • Güler I; Walter Schottky Institut and Physik Department, Technische Universität München, Am Coulombwall 4, 85748 Garching, Germany.
  • Dong J; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Wang K; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Köhler MH; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Jakobi M; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Menze BH; Department of Computer Science, Technical University of Munich, 85748 Garching, Germany.
  • Yetisen AK; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
  • Sharp ID; Walter Schottky Institut and Physik Department, Technische Universität München, Am Coulombwall 4, 85748 Garching, Germany.
  • Stier AV; Walter Schottky Institut and Physik Department, Technische Universität München, Am Coulombwall 4, 85748 Garching, Germany.
  • Finley JJ; Walter Schottky Institut and Physik Department, Technische Universität München, Am Coulombwall 4, 85748 Garching, Germany.
  • Koch AW; Institute for Measurement Systems and Sensor Technology, Department of Electrical and Computer Engineering, Technical University of Munich, 80333 Munich Germany.
ACS Nano ; 15(2): 3139-3151, 2021 Feb 23.
Article en En | MEDLINE | ID: mdl-33464815
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: ACS Nano Año: 2021 Tipo del documento: Article Pais de publicación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: ACS Nano Año: 2021 Tipo del documento: Article Pais de publicación: Estados Unidos