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Microwave-assisted chemical recovery of glass fiber and epoxy resin from non-metallic components in waste printed circuit boards.
Huang, Kaiyou; Zheng, Jiongli; Yuan, Wenyi; Wang, Xiaoyan; Song, Qingbin; Li, Ying; Crittenden, John C; Wang, Lincai; Wang, Jingwei.
Afiliación
  • Huang K; Shanghai Collaborative Innovation Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China.
  • Zheng J; Shanghai Collaborative Innovation Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China.
  • Yuan W; Shanghai Collaborative Innovation Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China.
  • Wang X; Shanghai Collaborative Innovation Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China.
  • Song Q; Macau Environmental Research Institute, Macau University of Science and Technology, Macau, China.
  • Li Y; School of Environment and Safety Engineering, North University of China, Taiyuan 030051, China.
  • Crittenden JC; Brook Byers Institute for Sustainable Systems and the Department of Civil and Environmental Engineering, Atlanta 30332, United States.
  • Wang L; Shanghai Collaborative Innovation Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China.
  • Wang J; Shanghai Collaborative Innovation Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China.
Waste Manag ; 124: 8-16, 2021 Apr 01.
Article en En | MEDLINE | ID: mdl-33592321
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Residuos Electrónicos Idioma: En Revista: Waste Manag Asunto de la revista: SAUDE AMBIENTAL / TOXICOLOGIA Año: 2021 Tipo del documento: Article País de afiliación: China Pais de publicación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Residuos Electrónicos Idioma: En Revista: Waste Manag Asunto de la revista: SAUDE AMBIENTAL / TOXICOLOGIA Año: 2021 Tipo del documento: Article País de afiliación: China Pais de publicación: Estados Unidos