Interface-engineered electron and hole tunneling.

Guo, Rui; Tao, Lingling; Li, Ming; Liu, Zhongran; Lin, Weinan; Zhou, Guowei; Chen, Xiaoxin; Liu, Liang; Yan, Xiaobing; Tian, He; Tsymbal, Evgeny Y; Chen, Jingsheng

Guo, Rui; Tao, Lingling; Li, Ming; Liu, Zhongran; Lin, Weinan; Zhou, Guowei; Chen, Xiaoxin; Liu, Liang; Yan, Xiaobing; Tian, He; Tsymbal, Evgeny Y; Chen, Jingsheng.

Afiliación

Guo R; Department of Materials Science and Engineering, National University of Singapore, 117575 Singapore, Singapore.
Tao L; College of Electron and Information Engineering, Hebei University, Baoding 071002, China.
Li M; Department of Physics and Astronomy and Nebraska Center for Materials and Nanoscience, University of Nebraska, Lincoln, NE 68588-0299, USA.
Liu Z; Department of Physics and Astronomy and Nebraska Center for Materials and Nanoscience, University of Nebraska, Lincoln, NE 68588-0299, USA.
Lin W; Center of Electron Microscope, State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China.
Zhou G; Department of Materials Science and Engineering, National University of Singapore, 117575 Singapore, Singapore.
Chen X; Department of Materials Science and Engineering, National University of Singapore, 117575 Singapore, Singapore.
Liu L; Key Laboratory of Magnetic Molecules and Magnetic Information Materials of Ministry of Education, School of Chemistry and Materials Science, Shanxi Normal University, Linfen 041004, China.
Yan X; Center of Electron Microscope, State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China.
Tian H; Department of Materials Science and Engineering, National University of Singapore, 117575 Singapore, Singapore.
Tsymbal EY; College of Electron and Information Engineering, Hebei University, Baoding 071002, China.
Chen J; Center of Electron Microscope, State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China. msecj@nus.edu.sg tsymbal@unl.edu hetian@zju.edu.cn.

Sci Adv ; 7(13)2021 Mar.

Article en En | MEDLINE | ID: mdl-33762343

Texto completo

Añadir a Mi BVS

Imprimir

XML

PubMed Links

Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2021 Tipo del documento: Article País de afiliación: Singapur Pais de publicación: Estados Unidos

Texto completo

Añadir a Mi BVS

Imprimir

XML

PubMed Links

Buscar en Google