Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications.
Rev Sci Instrum
; 92(4): 044907, 2021 Apr 01.
Article
en En
| MEDLINE
| ID: mdl-34243450
ABSTRACT
The development of high thermal conductivity thin film materials for the thermal management of electronics requires accurate and precise methods for characterizing heat spreading capability, namely, in-plane thermal conductivity. However, due to the complex nature of thin film thermal property measurements, resolving the in-plane thermal conductivity of high thermal conductivity anisotropic thin films with high accuracy is particularly challenging. Capable transient techniques exist; however, they usually measure thermal diffusivity and require heat capacity and density to deduce thermal conductivity. Here, we present an explicit uncertainty analysis framework for accurately resolving in-plane thermal conductivity via two independent steady-state thermometry techniques particle-assisted Raman thermometry and electrical resistance thermometry. Additionally, we establish error-based criteria to determine the limiting experimental conditions that permit the simplifying assumption of one-dimensional thermal conduction to further reduce thermal analysis. We demonstrate the accuracy and precision (<5% uncertainty) of both steady-state techniques through in-plane thermal conductivity measurements of anisotropic nanocrystalline diamond thin films.
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Colección:
01-internacional
Base de datos:
MEDLINE
Idioma:
En
Revista:
Rev Sci Instrum
Año:
2021
Tipo del documento:
Article
País de afiliación:
Estados Unidos