Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography.

Ni, Shu; Berenschot, Erwin J W; Westerik, Pieter J; de Boer, Meint J; Wolf, René; Le-The, Hai; Gardeniers, Han J G E; Tas, Niels R

Ni, Shu; Berenschot, Erwin J W; Westerik, Pieter J; de Boer, Meint J; Wolf, René; Le-The, Hai; Gardeniers, Han J G E; Tas, Niels R.

Afiliación

Ni S; Mesoscale Chemical System Group, MESA+ Institute, University of Twente, 7522 NB Enschede, The Netherlands.
Berenschot EJW; Inorganic Materials Science Group, MESA+ Institute, University of Twente, 7522 NB Enschede, The Netherlands.
Westerik PJ; Mesoscale Chemical System Group, MESA+ Institute, University of Twente, 7522 NB Enschede, The Netherlands.
de Boer MJ; Mesoscale Chemical System Group, MESA+ Institute, University of Twente, 7522 NB Enschede, The Netherlands.
Wolf R; NanoLab Cleanroom, MESA+ Institute, University of Twente, 7522 NB Enschede, The Netherlands.
Le-The H; NanoLab Cleanroom, MESA+ Institute, University of Twente, 7522 NB Enschede, The Netherlands.
Gardeniers HJGE; Physics of Fluids Group, MESA+ Institute & Max Planck Center for Complex Fluid Dynamics, University of Twente, 7522 NB Enschede, The Netherlands.
Tas NR; BIOS Lab-on-a-Chip Group, MESA+ Institute & Max Planck Center for Complex Fluid Dynamics, University of Twente, 7522 NB Enschede, The Netherlands.

Microsyst Nanoeng ; 6: 25, 2020.

Article en En | MEDLINE | ID: mdl-34567640

Palabras clave

Engineering; Nanoscience and technology

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Microsyst Nanoeng Año: 2020 Tipo del documento: Article País de afiliación: Países Bajos Pais de publicación: Reino Unido

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