High-reliability, high-melting, lead-free, mixed solder paste System-BiAgXâ.
Rev Sci Instrum
; 92(9): 099501, 2021 Sep 01.
Article
en En
| MEDLINE
| ID: mdl-34598547
ABSTRACT
BiAgX®, a mixed solder powder paste composed of a primary high-melting solder powder and an additive low-melting solder powder, exhibited a melting temperature above 260 °C and was comparable to, or even better than, the reliability of high-lead solders. The additive solder is designed to react preferentially with various surface metallizations and form a controllable intermetallic layer. Inside the joints, sub-micron AgSn particles are dispersed surrounding Bi colonies, which constrain the dislocation movement, thus enhancing strength, ductility, and associated joint reliability.
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1
Colección:
01-internacional
Base de datos:
MEDLINE
Idioma:
En
Revista:
Rev Sci Instrum
Año:
2021
Tipo del documento:
Article
País de afiliación:
Estados Unidos