Failure Mechanisms of Cu-Cu Bumps under Thermal Cycling.

Shie, Kai-Cheng; Hsu, Po-Ning; Li, Yu-Jin; Tran, Dinh-Phuc; Chen, Chih

Shie, Kai-Cheng; Hsu, Po-Ning; Li, Yu-Jin; Tran, Dinh-Phuc; Chen, Chih.

Afiliación

Shie KC; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Hsu PN; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Li YJ; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Tran DP; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Chen C; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

Materials (Basel) ; 14(19)2021 Sep 24.

Article en En | MEDLINE | ID: mdl-34639918

Palabras clave

Cu-to-Cu direct bonding; instant bonding; thermal cycling test

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2021 Tipo del documento: Article País de afiliación: Taiwán Pais de publicación: Suiza

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