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Complex 3D microfluidic architectures formed by mechanically guided compressive buckling.
Luan, Haiwen; Zhang, Qihui; Liu, Tzu-Li; Wang, Xueju; Zhao, Shiwei; Wang, Heling; Yao, Shenglian; Xue, Yeguang; Kwak, Jean Won; Bai, Wubin; Xu, Yameng; Han, Mengdi; Li, Kan; Li, Zhengwei; Ni, Xinchen; Ye, Jilong; Choi, Dongwhi; Yang, Quansan; Kim, Jae-Hwan; Li, Shuo; Chen, Shulin; Wu, Changsheng; Lu, Di; Chang, Jan-Kai; Xie, Zhaoqian; Huang, Yonggang; Rogers, John A.
Afiliación
  • Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Zhang Q; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Liu TL; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Wang X; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Zhao S; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Wang H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Yao S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Xue Y; Department of Materials Science and Engineering, Ohio State University, Columbus, OH 43210, USA.
  • Kwak JW; Department of Materials Science and Engineering, University of Connecticut, Storrs, CT 06269, USA.
  • Bai W; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Xu Y; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Han M; School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China.
  • Li K; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Li Z; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Ni X; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Ye J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Choi D; Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
  • Yang Q; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Kim JH; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Li S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Chen S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Wu C; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Lu D; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Chang JK; Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA.
  • Xie Z; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Huang Y; Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA.
  • Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
Sci Adv ; 7(43): eabj3686, 2021 Oct 22.
Article en En | MEDLINE | ID: mdl-34669471
ABSTRACT
Microfluidic technologies have wide-ranging applications in chemical analysis systems, drug delivery platforms, and artificial vascular networks. This latter area is particularly relevant to 3D cell cultures, engineered tissues, and artificial organs, where volumetric capabilities in fluid distribution are essential. Existing schemes for fabricating 3D microfluidic structures are constrained in realizing desired layout designs, producing physiologically relevant microvascular structures, and/or integrating active electronic/optoelectronic/microelectromechanical components for sensing and actuation. This paper presents a guided assembly approach that bypasses these limitations to yield complex 3D microvascular structures from 2D precursors that exploit the full sophistication of 2D fabrication methods. The capabilities extend to feature sizes <5 µm, in extended arrays and with various embedded sensors and actuators, across wide ranges of overall dimensions, in a parallel, high-throughput process. Examples include 3D microvascular networks with sophisticated layouts, deterministically designed and constructed to expand the geometries and operating features of artificial vascular networks.
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2021 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2021 Tipo del documento: Article País de afiliación: Estados Unidos