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High-Resolution 3D Printing for Electronics.
Park, Young-Geun; Yun, Insik; Chung, Won Gi; Park, Wonjung; Lee, Dong Ha; Park, Jang-Ung.
Afiliación
  • Park YG; Department of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
  • Yun I; Center for Nanomedicine, Institute for Basic Science (IBS), Seoul, 03722, Republic of Korea.
  • Chung WG; Graduate Program of Nano Biomedical Engineering (NanoBME), Advanced Science Institute, Yonsei University, Seoul, 03722, Republic of Korea.
  • Park W; Department of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
  • Lee DH; Center for Nanomedicine, Institute for Basic Science (IBS), Seoul, 03722, Republic of Korea.
  • Park JU; Graduate Program of Nano Biomedical Engineering (NanoBME), Advanced Science Institute, Yonsei University, Seoul, 03722, Republic of Korea.
Adv Sci (Weinh) ; 9(8): e2104623, 2022 Mar.
Article en En | MEDLINE | ID: mdl-35038249
ABSTRACT
The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high-resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D-printable functional materials and processes for various device components. The latest advances in 3D-printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next-generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Adv Sci (Weinh) Año: 2022 Tipo del documento: Article

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Adv Sci (Weinh) Año: 2022 Tipo del documento: Article