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Assembly of complex 3D structures and electronics on curved surfaces.
Xue, Zhaoguo; Jin, Tianqi; Xu, Shiwei; Bai, Ke; He, Qi; Zhang, Fan; Cheng, Xu; Ji, Ziyao; Pang, Wenbo; Shen, Zhangming; Song, Honglie; Shuai, Yumeng; Zhang, Yihui.
Afiliación
  • Xue Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Jin T; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.
  • Xu S; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Bai K; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.
  • He Q; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Zhang F; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.
  • Cheng X; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Ji Z; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.
  • Pang W; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Shen Z; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Song H; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.
  • Shuai Y; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
  • Zhang Y; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China.
Sci Adv ; 8(32): eabm6922, 2022 Aug 12.
Article en En | MEDLINE | ID: mdl-35947653
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2022 Tipo del documento: Article Pais de publicación: Estados Unidos
Texto completo
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2022 Tipo del documento: Article Pais de publicación: Estados Unidos