The Effect of Ultrasonic Agitation on the Seedless Growth of Cu on Ru-W Thin Films.

Santos, Rúben F; Oliveira, Bruno M C; Ferreira, Paulo J; Vieira, Manuel F

Santos, Rúben F; Oliveira, Bruno M C; Ferreira, Paulo J; Vieira, Manuel F.

Afiliación

Santos RF; Department of Metallurgical and Materials Engineering, University of Porto, 4200-465 Porto, Portugal.
Oliveira BMC; LAETA/INEGI-Institute of Science and Innovation in Mechanical and Industrial Engineering, 4200-465 Porto, Portugal.
Ferreira PJ; Department of Metallurgical and Materials Engineering, University of Porto, 4200-465 Porto, Portugal.
Vieira MF; LAETA/INEGI-Institute of Science and Innovation in Mechanical and Industrial Engineering, 4200-465 Porto, Portugal.

Materials (Basel) ; 16(1)2022 Dec 24.

Article en En | MEDLINE | ID: mdl-36614506

Palabras clave

Cu; Ru; W; acidic; agitation; diffusion barrier; electroplating; seedless; ultrasound

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2022 Tipo del documento: Article País de afiliación: Portugal Pais de publicación: Suiza

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