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An in-memory computing architecture based on a duplex two-dimensional material structure for in situ machine learning.
Ning, Hongkai; Yu, Zhihao; Zhang, Qingtian; Wen, Hengdi; Gao, Bin; Mao, Yun; Li, Yuankun; Zhou, Ying; Zhou, Yue; Chen, Jiewei; Liu, Lei; Wang, Wenfeng; Li, Taotao; Li, Yating; Meng, Wanqing; Li, Weisheng; Li, Yun; Qiu, Hao; Shi, Yi; Chai, Yang; Wu, Huaqiang; Wang, Xinran.
Afiliación
  • Ning H; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Yu Z; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. zhihao@nju.edu.cn.
  • Zhang Q; School of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing, China. zhihao@nju.edu.cn.
  • Wen H; School of Integrated Circuits, Tsinghua University, Beijing, China.
  • Gao B; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Mao Y; School of Integrated Circuits, Tsinghua University, Beijing, China. gaob1@tsinghua.edu.cn.
  • Li Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Zhou Y; School of Integrated Circuits, Tsinghua University, Beijing, China.
  • Zhou Y; School of Integrated Circuits, Tsinghua University, Beijing, China.
  • Chen J; Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong, China.
  • Liu L; Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong, China.
  • Wang W; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Li T; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Li Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Meng W; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Li W; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Li Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Qiu H; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Shi Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Chai Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Wu H; Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong, China.
  • Wang X; School of Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn.
Nat Nanotechnol ; 18(5): 493-500, 2023 May.
Article en En | MEDLINE | ID: mdl-36941361
ABSTRACT
The growing computational demand in artificial intelligence calls for hardware solutions that are capable of in situ machine learning, where both training and inference are performed by edge computation. This not only requires extremely energy-efficient architecture (such as in-memory computing) but also memory hardware with tunable properties to simultaneously meet the demand for training and inference. Here we report a duplex device structure based on a ferroelectric field-effect transistor and an atomically thin MoS2 channel, and realize a universal in-memory computing architecture for in situ learning. By exploiting the tunability of the ferroelectric energy landscape, the duplex building block demonstrates an overall excellent performance in endurance (>1013), retention (>10 years), speed (4.8 ns) and energy consumption (22.7 fJ bit-1 µm-2). We implemented a hardware neural network using arrays of two-transistors-one-duplex ferroelectric field-effect transistor cells and achieved 99.86% accuracy in a nonlinear localization task with in situ trained weights. Simulations show that the proposed device architecture could achieve the same level of performance as a graphics processing unit under notably improved energy efficiency. Our device core can be combined with silicon circuitry through three-dimensional heterogeneous integration to give a hardware solution towards general edge intelligence.

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Nanotechnol Año: 2023 Tipo del documento: Article País de afiliación: China

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Nanotechnol Año: 2023 Tipo del documento: Article País de afiliación: China