Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiC<sub>p</sub> at Intermediate Temperature after KOBO Extrusion and Aging.

Wang, Yang-Yang; Jia, Chen; Xu, Min; Kaseem, Mosab; Tayebi, Morteza

Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiC_p at Intermediate Temperature after KOBO Extrusion and Aging.

Wang, Yang-Yang; Jia, Chen; Xu, Min; Kaseem, Mosab; Tayebi, Morteza.

Afiliación

Wang YY; School of Engineering, Xi'an Siyuan University, Xi'an 710038, China.
Jia C; Xi'an Aerospace Propulsion Test Technology Institute, Xi'an 710100, China.
Xu M; Xi'an Aerospace Propulsion Test Technology Institute, Xi'an 710100, China.
Kaseem M; Corrosion and Electrochemistry Laboratory, Department of Nanotechnology and Advanced Materials Engineering, Sejong University, Seoul 05006, Republic of Korea.
Tayebi M; Young Researchers and Elites Club, Science and Research Branch, Islamic Azad University, Tehran 14778-93855, Iran.

Materials (Basel) ; 16(10)2023 May 22.

Article en En | MEDLINE | ID: mdl-37241511

Palabras clave

ZK60/SiCp composite; grain boundary serration; kink band; shear band

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China Pais de publicación: Suiza

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