Room-Temperature Liquid Metals for Flexible Electronic Devices.

Lu, Guixuan; Ni, Erli; Jiang, Yanyan; Wu, Weikang; Li, Hui

Lu, Guixuan; Ni, Erli; Jiang, Yanyan; Wu, Weikang; Li, Hui.

Afiliación

Lu G; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), School of Materials Science and Engineering, Shandong University, Jinan, Shandong, 250061, China.
Ni E; The Institute for Advanced Studies of Wuhan University, Wuhan University, Wuhan, Hubei, 430072, China.
Jiang Y; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), School of Materials Science and Engineering, Shandong University, Jinan, Shandong, 250061, China.
Wu W; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), School of Materials Science and Engineering, Shandong University, Jinan, Shandong, 250061, China.
Li H; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), School of Materials Science and Engineering, Shandong University, Jinan, Shandong, 250061, China.

Small ; 20(9): e2304147, 2024 Mar.

Article en En | MEDLINE | ID: mdl-37875665

Palabras clave

flexible electronics; liquid metals; patterning; sintering

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Small Asunto de la revista: ENGENHARIA BIOMEDICA Año: 2024 Tipo del documento: Article País de afiliación: China Pais de publicación: Alemania

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