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An Experimental Study of a Composite Wick Structure for Ultra-Thin Flattened Heat Pipes.
Zhou, Wenjie; Yang, Yong; He, Junfeng; Chen, Ri; Jian, Yue; Shao, Dan; Wu, Aihua.
Afiliación
  • Zhou W; Guangdong Key Laboratory of Battery Safety, Guangzhou Institute of Energy Testing, Guangzhou 511447, China.
  • Yang Y; School of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510450, China.
  • He J; School of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510450, China.
  • Chen R; School of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510450, China.
  • Jian Y; School of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510450, China.
  • Shao D; School of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510450, China.
  • Wu A; Guangdong Key Laboratory of Battery Safety, Guangzhou Institute of Energy Testing, Guangzhou 511447, China.
Micromachines (Basel) ; 15(6)2024 Jun 06.
Article en En | MEDLINE | ID: mdl-38930734
ABSTRACT
As the thickness of an ultra-thin flattened heat pipe (UTHP) decreases, the fabrication difficulty increases exponentially, and the thermal performance deteriorates rapidly. In this study, three types of composite wicks were developed for UTHPs with a 0.6 mm thickness copper foam and mesh wick (CFMW), two layers of different mesh wick (TDMW), and three layers of the same mesh wick (TSMW). The startup and steady-state performances of the UTHPs with liquid filling ratios of 60% to 120% were investigated. The findings indicated that the CFMW UTHP with a filling ratio of 100% exhibited the best startup performance, with the highest equilibrium temperature of 58.37 °C. The maximum heat transport capacities of the CFMW, TDMW, and TSMW UTHP samples were 9, 8, and 8.5 W, respectively, at their corresponding optimum filling ratios of 110%, 90%, and 100%. The CFMW UTHP exhibited the lowest evaporation and condensation thermal resistances of 0.151 and 0.189 K/W, respectively, which were 24.67% and 41.85% lower than those of the TSMW UTHP. CFMW can be used to improve the thermal performance of UTHPs. This study provides important guidelines for the structural design, fabrication technology, and performance improvement of high-performance UTHPs used in portable electronic devices.
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2024 Tipo del documento: Article País de afiliación: China Pais de publicación: Suiza

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2024 Tipo del documento: Article País de afiliación: China Pais de publicación: Suiza