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Fabrication of Low Cost and Low Temperature Poly-Silicon Nanowire Sensor Arrays for Monolithic Three-Dimensional Integrated Circuits Applications.
Tang, Siqi; Yan, Jiang; Zhang, Jing; Wei, Shuhua; Zhang, Qingzhu; Li, Junjie; Fang, Min; Zhang, Shuang; Xiong, Enyi; Wang, Yanrong; Yang, Jianglan; Zhang, Zhaohao; Wei, Qianhui; Yin, Huaxiang; Wang, Wenwu; Tu, Hailing.
Affiliation
  • Tang S; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Yan J; Advanced Integrated Circuits R&D Center, Institute of Microelectronic of the Chinese Academy of Sciences, Beijing 100029, China.
  • Zhang J; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Wei S; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Zhang Q; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Li J; Advanced Integrated Circuits R&D Center, Institute of Microelectronic of the Chinese Academy of Sciences, Beijing 100029, China.
  • Fang M; Advanced Integrated Circuits R&D Center, Institute of Microelectronic of the Chinese Academy of Sciences, Beijing 100029, China.
  • Zhang S; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Xiong E; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Wang Y; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Yang J; School of Information Science and Technology, North China University of Technology, Beijing 100144, China.
  • Zhang Z; State Key Laboratory of Advanced Materials for Smart Sensing, General Research Institute for Nonferrous Metals, Beijing 101402, China.
  • Wei Q; Advanced Integrated Circuits R&D Center, Institute of Microelectronic of the Chinese Academy of Sciences, Beijing 100029, China.
  • Yin H; State Key Laboratory of Advanced Materials for Smart Sensing, General Research Institute for Nonferrous Metals, Beijing 101402, China.
  • Wang W; Advanced Integrated Circuits R&D Center, Institute of Microelectronic of the Chinese Academy of Sciences, Beijing 100029, China.
  • Tu H; School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China.
Nanomaterials (Basel) ; 10(12)2020 Dec 11.
Article de En | MEDLINE | ID: mdl-33322344
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Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Type d'étude: Health_economic_evaluation Langue: En Journal: Nanomaterials (Basel) Année: 2020 Type de document: Article Pays d'affiliation: Chine Pays de publication: Suisse
Texte intégral
Ajouter à My VHL
Imprimer
XML
PubMed Links
Recherche sur Google

Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Type d'étude: Health_economic_evaluation Langue: En Journal: Nanomaterials (Basel) Année: 2020 Type de document: Article Pays d'affiliation: Chine Pays de publication: Suisse