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Publisher Correction: Soft-lock drawing of super-aligned carbon nanotube bundles for nanometre electrical contacts.
Guo, Yunfan; Shi, Enzheng; Zhu, Jiadi; Shen, Pin-Chun; Wang, Jiangtao; Lin, Yuxuan; Mao, Yunwei; Deng, Shibin; Li, Baini; Park, Ji-Hoon; Lu, Ang-Yu; Zhang, Shuchen; Ji, Qingqing; Li, Zhe; Qiu, Chenguang; Qiu, Song; Li, Qingwen; Dou, Letian; Wu, Yue; Zhang, Jin; Palacios, Tomás; Cao, Anyuan; Kong, Jing.
Affiliation
  • Guo Y; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Shi E; Research Institute of Frontier Technology, College of Micro-Nano Electronics, Zhejiang University, Hangzhou, China.
  • Zhu J; Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China. shienzheng@westlake.edu.cn.
  • Shen PC; School of Materials Science and Engineering, Peking University, Beijing, China. shienzheng@westlake.edu.cn.
  • Wang J; Davidson School of Chemical Engineering, Purdue University, West Lafayette, IN, USA. shienzheng@westlake.edu.cn.
  • Lin Y; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Mao Y; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Deng S; Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
  • Li B; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Park JH; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Lu AY; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Zhang S; Department of Chemistry, Purdue University, West Lafayette, IN, USA.
  • Ji Q; Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China.
  • Li Z; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Qiu C; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Qiu S; College of Chemistry and Molecular Engineering, Peking University, Beijing, China.
  • Li Q; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Dou L; Department of Chemical and Biological Engineering, Iowa State University, Ames, IA, USA.
  • Wu Y; Key Laboratory for the Physics and Chemistry of Nanodevices and Department of Electronics, Peking University, Beijing, China.
  • Zhang J; Division of Advanced Nano-Materials, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, China.
  • Palacios T; Division of Advanced Nano-Materials, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, China.
  • Cao A; Davidson School of Chemical Engineering, Purdue University, West Lafayette, IN, USA.
  • Kong J; Department of Chemical and Biological Engineering, Iowa State University, Ames, IA, USA.
Nat Nanotechnol ; 17(3): 331, 2022 Mar.
Article de En | MEDLINE | ID: mdl-35277587
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Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Langue: En Journal: Nat Nanotechnol Année: 2022 Type de document: Article Pays d'affiliation: États-Unis d'Amérique
Texte intégral
Ajouter à My VHL
Imprimer
XML
PubMed Links
Recherche sur Google

Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Langue: En Journal: Nat Nanotechnol Année: 2022 Type de document: Article Pays d'affiliation: États-Unis d'Amérique