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An artificial neural network chip based on two-dimensional semiconductor.
Ma, Shunli; Wu, Tianxiang; Chen, Xinyu; Wang, Yin; Tang, Hongwei; Yao, Yuting; Wang, Yan; Zhu, Ziyang; Deng, Jianan; Wan, Jing; Lu, Ye; Sun, Zhengzong; Xu, Zihan; Riaud, Antoine; Wu, Chenjian; Zhang, David Wei; Chai, Yang; Zhou, Peng; Ren, Junyan; Bao, Wenzhong.
Affiliation
  • Ma S; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Wu T; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Chen X; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Wang Y; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Tang H; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Yao Y; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Wang Y; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Zhu Z; State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University, Shanghai 200433, China.
  • Deng J; State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University, Shanghai 200433, China.
  • Wan J; State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University, Shanghai 200433, China.
  • Lu Y; State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University, Shanghai 200433, China.
  • Sun Z; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Xu Z; Shenzhen Sixcarbon Technology, Shenzhen 518106, China.
  • Riaud A; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Wu C; School of Electronic and Information Engineering, Soochow University, Suzhou 215006, China.
  • Zhang DW; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
  • Chai Y; Department of Applied Physics, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China.
  • Zhou P; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China. Electronic address: pengzhou@fudan.edu.cn.
  • Ren J; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China. Electronic address: junyanren@fudan.edu.cn.
  • Bao W; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China. Electronic address: baowz@fudan.edu.cn.
Sci Bull (Beijing) ; 67(3): 270-277, 2022 02 15.
Article de En | MEDLINE | ID: mdl-36546076
ABSTRACT
Recently, research on two-dimensional (2D) semiconductors has begun to translate from the fundamental investigation into rudimentary functional circuits. In this work, we unveil the first functional MoS2 artificial neural network (ANN) chip, including multiply-and-accumulate (MAC), memory and activation function circuits. Such MoS2 ANN chip is realized through fabricating 818 field-effect transistors (FETs) on a wafer-scale and high-homogeneity MoS2 film, with a gate-last process to realize top gate structured FETs. A 62-level simulation program with integrated circuit emphasis (SPICE) model is utilized to design and optimize our analog ANN circuits. To demonstrate a practical application, a tactile digit sensing recognition was demonstrated based on our ANN circuits. After training, the digit recognition rate exceeds 97%. Our work not only demonstrates the protentional of 2D semiconductors in wafer-scale integrated circuits, but also paves the way for its future application in AI computation.
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Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Sujet principal: Children's health insurance program (USA) / Molybdène Langue: En Journal: Sci Bull (Beijing) Année: 2022 Type de document: Article Pays d'affiliation: Chine

Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Sujet principal: Children's health insurance program (USA) / Molybdène Langue: En Journal: Sci Bull (Beijing) Année: 2022 Type de document: Article Pays d'affiliation: Chine