Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States.

Chen, Naiqi; Yang, Kunming; Wang, Ziyang; Zhong, Boan; Wang, Jingjing; Song, Jian; Li, Quan; Ni, Jiamiao; Sun, Fangyuan; Liu, Yue; Fan, Tongxiang

Chen, Naiqi; Yang, Kunming; Wang, Ziyang; Zhong, Boan; Wang, Jingjing; Song, Jian; Li, Quan; Ni, Jiamiao; Sun, Fangyuan; Liu, Yue; Fan, Tongxiang.

Affiliation

Chen N; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Yang K; Institute of Materials, China Academy of Engineering Physics, Mianyang 621900, Sichuan, China.
Wang Z; School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Zhong B; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Wang J; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Song J; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Li Q; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Ni J; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Sun F; School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Liu Y; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Fan T; State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.

ACS Appl Mater Interfaces ; 15(28): 34132-34144, 2023 Jul 19.

Article de En | MEDLINE | ID: mdl-37405384

Mots clés

boron nitride/copper interface; interfacial bonding; phonon density of states; phonon relaxation time; phonon transmission coefficient; time-domain thermoreflectance

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Texte intégral: 1 Collection: 01-internacional Base de données: MEDLINE Langue: En Journal: ACS Appl Mater Interfaces Sujet du journal: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Année: 2023 Type de document: Article Pays d'affiliation: Chine Pays de publication: États-Unis d'Amérique

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