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Polyimide surface modification by using microwave plasma for adhesion enhancement of Cu electroless plating.
Cho, Sang-Jin; Nguyen, Trieu; Boo, Jin-Hyo.
Affiliation
  • Cho SJ; Department of Chemistry and Institute of Basic Science, SungKyunKwan University, Suwon 440-746, Republic of Korea.
J Nanosci Nanotechnol ; 11(6): 5328-33, 2011 Jun.
Article in En | MEDLINE | ID: mdl-21770184
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Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2011 Document type: Article Country of publication:
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PubMed Links

Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2011 Document type: Article Country of publication: