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Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.
Zhang, Peng; Xue, Songbai; Liu, Lu; Wu, Jie; Luo, Qingcheng; Wang, Jianhao.
Affiliation
  • Zhang P; College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
  • Xue S; College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
  • Liu L; College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
  • Wu J; College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
  • Luo Q; College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
  • Wang J; Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 565-0047, Japan.
Polymers (Basel) ; 14(23)2022 Dec 04.
Article in En | MEDLINE | ID: mdl-36501697
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Polymers (Basel) Year: 2022 Document type: Article Affiliation country:
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Polymers (Basel) Year: 2022 Document type: Article Affiliation country: