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Metallic Micro-Nano Network-Based Soft Transparent Electrodes: Materials, Processes, and Applications.
Chen, Liyang; Khan, Arshad; Dai, Shuqin; Bermak, Amine; Li, Wen-Di.
Affiliation
  • Chen L; Department of Mechanical Engineering, University of Hong Kong, Hong Kong, 00000, China.
  • Khan A; Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland.
  • Dai S; Department of Mechanical Engineering, University of Hong Kong, Hong Kong, 00000, China.
  • Bermak A; Division of Information and Computing Technology, College of Science and Engineering, Hamad Bin Khalifa University, Doha, 34110, Qatar.
  • Li WD; Department School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore.
Adv Sci (Weinh) ; 10(35): e2302858, 2023 Dec.
Article in En | MEDLINE | ID: mdl-37890452
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Adv Sci (Weinh) Year: 2023 Document type: Article Affiliation country: Country of publication:
Fulltext
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Adv Sci (Weinh) Year: 2023 Document type: Article Affiliation country: Country of publication: