An All-Silicon Resonant Pressure Microsensor Based on Eutectic Bonding.

Chen, Siyuan; Qin, Jiaxin; Lu, Yulan; Xie, Bo; Wang, Junbo; Chen, Deyong; Chen, Jian

Chen, Siyuan; Qin, Jiaxin; Lu, Yulan; Xie, Bo; Wang, Junbo; Chen, Deyong; Chen, Jian.

Afiliação

Chen S; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.
Qin J; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
Lu Y; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.
Xie B; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
Wang J; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.
Chen D; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
Chen J; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.

Micromachines (Basel) ; 14(2)2023 Feb 13.

Article em En | MEDLINE | ID: mdl-36838141

Palavras-chave

eutectic bonding; high accuracy; resonant pressure sensor; temperature-insensitive; thermal mismatch

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China País de publicação: Suíça

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