Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.

Kim, S-H; Braun, T M; Lee, H-J; Moffat, T P; Josell, D

Kim, S-H; Braun, T M; Lee, H-J; Moffat, T P; Josell, D.

Afiliação

Kim SH; Department of Materials Science and Engineering, Dong-A University, Saha-Gu, Busan 49315 Korea.
Braun TM; Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 USA.
Lee HJ; Department of Materials Science and Engineering, Dong-A University, Saha-Gu, Busan 49315 Korea.
Moffat TP; Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 USA.
Josell D; Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 USA.

J Electrochem Soc ; 169(3)2022.

Article em En | MEDLINE | ID: mdl-36936546

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: J Electrochem Soc Ano de publicação: 2022 Tipo de documento: Article País de publicação: Reino Unido

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