3D-printed facet-attached optical elements for beam shaping in optical phased arrays.

We demonstrate an optical phased-array equipped with a 3D-printed facet-attached element for shaping and deflection of the emitted beam. The beam shaper combines freeform refractive surfaces with total-internal-reflection mirrors and is in-situ printed to edge-emitting waveguide facets using high-resolution multi-photon lithography, thereby ensuring precise alignment with respect to on-chip waveguide structures. In a proof-of-concept experiment, we achieve a grating-lobe free steering range of ±30∘ and a full-width-half-maximum beam divergence of approximately 2∘. The concept opens an attractive alternative to currently used grating structures and is applicable to a wide range of integration platforms.

Granular aluminium as a superconducting material for high-impedance quantum circuits.

Superconducting quantum information processing machines are predominantly based on microwave circuits with relatively low characteristic impedance, about 100 Ω, and small anharmonicity, which can limit their coherence and logic gate fidelity1,2. A promising alternative is circuits based on so-called superinductors3-6, with characteristic impedances exceeding the resistance quantum RQ = 6.4 kΩ. However, previous implementations of superinductors, consisting of mesoscopic Josephson junction arrays7,8, can introduce unintended nonlinearity or parasitic resonant modes in the qubit vicinity, degrading its coherence. Here, we present a fluxonium qubit design based on a granular aluminium superinductor strip9-11. We show that granular aluminium can form an effective junction array with high kinetic inductance and be in situ integrated with standard aluminium circuit processing. The measured qubit coherence time [Formula: see text] illustrates the potential of granular aluminium for applications ranging from protected qubit designs to quantum-limited amplifiers and detectors.

Loss Mechanisms and Quasiparticle Dynamics in Superconducting Microwave Resonators Made of Thin-Film Granular Aluminum.

Superconducting high kinetic inductance elements constitute a valuable resource for quantum circuit design and millimeter-wave detection. Granular aluminum (grAl) in the superconducting regime is a particularly interesting material since it has already shown a kinetic inductance in the range of nH/□ and its deposition is compatible with conventional Al/AlOx/Al Josephson junction fabrication. We characterize microwave resonators fabricated from grAl with a room temperature resistivity of 4×10^{3} µΩ cm, which is a factor of 3 below the superconductor to insulator transition, showing a kinetic inductance fraction close to unity. The measured internal quality factors are on the order of Q_{i}=10^{5} in the single photon regime, and we demonstrate that nonequilibrium quasiparticles (QPs) constitute the dominant loss mechanism. We extract QP relaxation times in the range of 1 s and we observe QP bursts every ∼20 s. The current level of coherence of grAl resonators makes them attractive for integration in quantum devices, while it also evidences the need to reduce the density of nonequilibrium QPs.

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography.

Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage, the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips, thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However, while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments, it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements. In this paper, we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres. In a first experiment, we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation. A second experiment is dedicated to a four-channel coherent transmitter, operating at a net data rate of 732.7 Gbit/s - a record for coherent silicon photonic transmitters with co-packaged lasers. Using dedicated test chips, we further demonstrate automated mass production of photonic wire bonds with insertion losses of (0.7 ± 0.15) dB, and we show their resilience in environmental-stability tests and at high optical power. These results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.