Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating.

With the rapid development of electronic technology and large-scale integrated circuit devices, it is very important to develop thermal management materials with high thermal conductivity. Silicon carbide whisker-reinforced copper matrix (Cu/SiCw) composites are considered to be one of the best candidates for future electronic device radiators. However, at present, most of these materials are produced by high-temperature and high-pressure processes, which are expensive and prone to interfacial reactions. To explore the plating solution system suitable for SiCw and Cu composite electroplating, we tried two different Cu-based plating solutions, namely a Systek UVF 100 plating solution of the copper sulfate (CuSO4) system and a Through Silicon Via (TSV) plating solution of the copper methanesulfonate (Cu(CH3SO3)2) system. In this paper, Cu/SiCw composites were prepared by composite electrodeposition. The morphology of the coating under two different plating liquid systems was compared, and the mechanism of formation of the different morphologies was analyzed. The results show that when the concentration of SiCw in the bath is 1.2 g/L, the surface of the Cu/SiCw composite coating prepared by the CuSO4 bath has more whiskers with irregular distribution and the coating is very smooth, but there are pores at the junction of the whiskers and Cu. There are a large number of irregularly distributed whiskers on the surface of the Cu/SiCw composite coating prepared with the copper methanesulfonate (Cu(CH3SO3)2) system. The surface of the composite is flat, and Cu grows along the whisker structure. The whisker and Cu form a good combination, and there is no pore in the cross-section of the coating. The observation at the cross-section also reveals some characteristics of the toughening mechanism of SiCw, including crack deflection, bridging and whisker pull-out. The existence of these mechanisms indicates that SiCw plays a toughening role in the composites. A suitable plating solution system was selected for the preparation of high-performance Cu/SiCw thermal management materials with the composite electrodeposition process.

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films.

While boron nitride (BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties, a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interfacial interaction causing severe phonon scattering. Here, we report a novel surface modification strategy called the "self-modified nanointerface" using BN nanocrystals (BNNCs) to efficiently link the interface between BN and the polymer matrix. Combining with ice-press assembly method, an only 25 wt% BN-embedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m-1 K-1 but also, more importantly, achieve a through-plane thermal conductivity as high as 21.3 W m-1 K-1, which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers, the strong interaction between the self-modified fillers and polymer matrix, as well as ladder-structured BN skeleton. The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU. This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites.

Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network.

The construction of an interconnected nanofiller network is critical for the preparation of highly effective thermal management composites, though it remains a challenge to eliminate the anisotropic thermal conductivity of the nanofiller-induced defective interfacial heat-flow efficiency. In this work, a facile and novel approach is proposed to optimize phonon transport by building a salt template-assisted three-dimensional (3D) carbonization nanohybrid network in an epoxy system. The advantage of the salt template relied on green and scalable merits to construct a 3D nanofiller network and supporting abundant holes for the introduction of a polymer matrix after washing. Meanwhile, the contained carbonization materials contributed to reducing the interfacial phonon scattering issues of the filler/filler and filler/polymer for an efficient heat-flow pathway. As a result of this effect, the prepared epoxy nano-composites presented a high thermal conductivity of 4.27 W/m K, resulting in a 1841% increase compared to the thermal conductivity of the pure epoxy resin. In addition, the epoxy composites exhibited good mechanical properties and thermal conductive performance during heating and cooling. Therefore, this study may provide new insights into the design and preparation of thermal management polymers to meet the applicational requirements of electronics.

Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting.

The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in next-generation heat management materials. Coating copper and titanium on the diamond particle surface could effectively modify and improve the wettability of the diamond/copper interface via electroless plating and evaporation methods, respectively. Here, these dense and complex composites were successfully three-dimensionally printed via selective laser melting. A high thermal conductivity (TC, 336 W/mK) was produced by 3D printing 1 vol.% copper-coated diamond/copper mixed powders at an energy density of 300 J/mm3 (laser power = 180 W and scanning rate = 200 mm/s). 1 and 3 vol.% copper-coated diamond/copper composites had lower coefficients of thermal expansions and higher TCs. They also had stronger bending strengths than the corresponding titanium-coated diamond/copper composites. The interface between copper matrix and diamond reinforcement was well bonded, and there was no cracking in the 1 vol.% copper-coated diamond/copper composite sample. The optimization of the printing parameters and strategy herein is beneficial to develop new approaches for the further construction of a wider range of micro-sized diamond particles reinforced metal matrix composites.

Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics.

Thermal management materials (TMMs) used in electronic devices are crucial for future electronics and technologies such as flexible electronics and artificial intelligence (AI) technologies. As future electronics will work in a more complicated circumstance, the overheating and overcooling problems can exist in the same electronics while the common TMMs cannot meet the demand of thermal management for future electronics. In this work, nacre-mimetic graphene-based films with super flexibility and durability (in over 10,000 tensile cycles), excellent capability to dissipate excess heat (20.84 W/(m·K) at only 16-22 µm thickness), and outstanding heating performance to generate urgent heat for electronics under extremely cold conditions are fabricated by a facile solution casting method, and the fabricated composites are proved to be superior multifunctional TMMs for the thermal management in electronic chips. In addition, the application of the paper-like films with high in-plane thermal conductivity to a flexible heat spreader and film heater is demonstrated by simulation using a finite volume method, which shows the high importance of the in-plane thermal conductivity in thermal management of electronics.

Scalable Approach to Construct Self-Assembled Graphene-Based Films with An Ordered Structure for Thermal Management.

Large-area bulk oxidized cellulose nanocrystal (OCNC)/graphene nanocomposites with highly oriented structures were produced through a straightforward, cost-effective large-scale evaporation-induced self-assembly process followed by thermal curing. Well-aligned nano-sized graphene layers were evident and separated by the OCNC planar layers, which facilitate highly interconnected and continuous thermal transport parallel to the alignment. Hence, the laminated graphene-based nanocomposites possess an excellent in-plane thermal conductivity of 25.66 W/m K and a thermal conductivity enhancement (η) of 7235% with only a 4.1 vol % graphene loading. This value is the highest recorded among all laminated composite films with <70 wt % filler content reported to date. Using this design strategy, other large-area aligned composites with other functional nanomaterials, already in large-scale production, can be made for use in a wide range of applications.