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Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition.
Kwon, Heungdong; Perez, Christopher; Kim, Hyojin K; Asheghi, Mehdi; Park, Woosung; Goodson, Kenneth E.
Afiliação
  • Kwon H; Department of Mechanical Engineering, Stanford University, Stanford, California 94305, United States.
  • Perez C; Department of Mechanical Engineering, Stanford University, Stanford, California 94305, United States.
  • Kim HK; Department of Mechanical Engineering, Stanford University, Stanford, California 94305, United States.
  • Asheghi M; Department of Mechanical Engineering, Stanford University, Stanford, California 94305, United States.
  • Park W; Division of Mechanical Systems Engineering, Sookmyung Women's University, Seoul 04310, South Korea.
  • Goodson KE; Department of Mechanical Engineering, Stanford University, Stanford, California 94305, United States.
ACS Appl Mater Interfaces ; 13(18): 21905-21913, 2021 May 12.
Article em En | MEDLINE | ID: mdl-33914509
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article