Kilohertz frame rate snapshot hyperspectral imaging of metal reactive materials.

We demonstrate a kilohertz frame rate snapshot hyperspectral imaging system suitable for high-speed imaging, which we name snapshot hyperspectral imager for emission and reactions (SHEAR). This system splits the sensor of a single high-speed camera to simultaneously capture a conventional image and a spectrally sheared response of the scene under study. Given the small, point-source-like nature of burning metal micro-particles, the spectral response of the species is captured without the need for a slit, as is needed in conventional imaging spectrometers. We pair robust image registration techniques with sparse reconstruction algorithms to computationally disentangle overlapping spectra associated with many burning particles over the course of a combustion experiment. As a proof-of-concept experiment, representative physical vapor deposited Al:Zr composite particles are ignited, and their burn evolution is recorded at a frame rate of 2 kHz using this method. We demonstrate operation over two distinct wavelength ranges spanning hundreds of nanometers in wavelength and with sub-nanometer resolution. We are able to track hundreds of individual Al:Zr particles in a single high-speed video, providing ample statistics of burn time, temperature, and AlO emission timing in a high-throughput method. The demonstrated technology is high-throughput, flexible in wavelength, inexpensive, and relatively easy to implement, and provides a much needed tool for in situ composite metal fuel diagnostics.

Widefield compressive multiphoton microscopy.

A single-pixel compressively sensed architecture is exploited to simultaneously achieve a 10× reduction in acquired data compared with the Nyquist rate, while alleviating limitations faced by conventional widefield temporal focusing microscopes due to scattering of the fluorescence signal. Additionally, we demonstrate an adaptive sampling scheme that further improves the compression and speed of our approach.

High-speed all-optical Haar wavelet transform for real-time image compression.

We present a high-speed single pixel flow imager based on an all-optical Haar wavelet transform of moving objects. Spectrally-encoded wavelet measurement patterns are produced by chirp processing of broad-bandwidth mode-locked laser pulses. A complete wavelet pattern set serially illuminates the object via a spectral disperser. This high-rate structured illumination transforms the scene into a set of sparse coefficients. We show that complex scenes can be compressed to less than 30% of their Nyquist rate by thresholding and storing the most significant wavelet coefficients. Moreover by employing temporal multiplexing of the patterns we are able to achieve pixel rates in excess of 360 MPixels/s.

Broadband rotary joint for high-speed ultrahigh-resolution endoscopic OCT imaging at 800 nm.

We report the development of a broadband rotary joint for high-speed ultrahigh-resolution endoscopic optical coherence tomography (OCT) imaging in the 800 nm spectral range. This rotary joint features a pair of achromatic doublets in order to achieve broadband operation for a 3 dB bandwidth over 150 nm. The measured one-way throughput of the rotary joint is greater than 80%, while the fluctuation of the double-pass coupling efficiency during 360 deg rotation is less than ±5% at a near video-rate speed of 20 revolutions/s (rps). The rotary joint is used in conjunction with a diffractive-optics-based endoscope and 800 nm spectral domain OCT system and achieved an ultrahigh axial resolution of ∼2.4 µm in air. The imaging performance is demonstrated by 3D circumferential imaging of a mouse colon in vivo.

A Miniature Wireless Silicon-on-Insulator Image Sensor for Brain Fluorescence Imaging.

Optical recording of genetically encoded calcium indicator (GECI) allows neuroscientists to study the activity of genetically labeled neuron populations, but our current tools lack the resolution, stability and are often too invasive. Here we present the design concepts, prototypes, and preliminary measurement results of a super-miniaturized wireless image sensor built using a 32nm Silicon-on-Insulator process. SOI process is optimal for wireless applications, and we can further thin the substrate to reduce overall device thickness to ~25µm and operate the pixels using back-side illumination. The proposed device is 300µm × 300µm. Our prototype is built on a 3 × 3mm die.