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1.
Opt Express ; 26(25): 32500-32508, 2018 Dec 10.
Artículo en Inglés | MEDLINE | ID: mdl-30645416

RESUMEN

We demonstrate lasing up to 230 K in a GeSn heterostructure micro-disk cavity. The GeSn 16.0% optically active layer was grown on a step-graded GeSn buffer, limiting the density of misfit dislocations. The lasing wavelengths shifted from 2720 to 2890 nm at 15 K up to 3200 nm at 230 K. Compared to results reported elsewhere, we attribute the increase in maximal lasing temperature to two factors: a stronger optical confinement by a thicker active layer and a better carrier confinement provided by a GeSn 13.8% / GeSn 16.0% / GeSn 13.8% double heterostructure.

2.
Nano Lett ; 12(2): 1032-7, 2012 Feb 08.
Artículo en Inglés | MEDLINE | ID: mdl-22251002

RESUMEN

We demonstrate that the optical energy carried by a TE dielectric waveguide mode can be totally transferred into a transverse plasmon mode of a coupled metal nanoparticle chain. Experiments are performed at 1.5 µm. Mode coupling occurs through the evanescent field of the dielectric waveguide mode. Giant coupling effects are evidenced from record coupling lengths as short as ~560 nm. This result opens the way to nanometer scale devices based on localized plasmons in photonic integrated circuits.


Asunto(s)
Oro/química , Nanopartículas del Metal/química , Dispositivos Ópticos , Silicio/química , Resonancia por Plasmón de Superficie
3.
ACS Appl Mater Interfaces ; 14(19): 22270-22277, 2022 May 18.
Artículo en Inglés | MEDLINE | ID: mdl-35510890

RESUMEN

Tin segregation in Ge1-xSnx alloys is one of the major problems potentially hindering the use of this material in devices. Ge1-xSnx microdisks fabricated from layers with Sn concentrations up to 16.9% underwent here annealing at temperatures as high as 400 °C for 20 min without Sn segregation, in contrast with the full segregation observed in the corresponding blanket layers annealed simultaneously. After annealing, no changes in the elemental composition of the microdisks were evidenced. An enhancement of the total integrated photoluminescence, with no modifications of the emission energy, was also observed. These findings show that microstructuring offers a completely new path in maintaining the stability of high Sn concentration Ge1-xSnx layers at temperatures much higher than those used for growth. This approach enables the use of thermal annealing processes to improve the properties of this alloy in optoelectronic devices (such as light emitting diodes, lasers, photodetectors, or modulators). It should also facilitate the integration of Ge1-xSnx into well-established technologies requiring medium temperature processes. The same strategy may help to prevent Sn segregation during high temperature processes in similar metastable alloys.

4.
Nano Lett ; 10(8): 2922-6, 2010 Aug 11.
Artículo en Inglés | MEDLINE | ID: mdl-20698605

RESUMEN

Coupling plasmonics and silicon photonics is the best way to bridge the size gap between macroscopic optics and nanodevices in general and especially nanoelectronic devices. We report on the realization of key blocks for future plasmonic planar integrated optics, nano-optical couplers, and nanoslot waveguides that are compatible both with the silicon photonics and the CMOS microelectronics. Copper-based devices provide for very efficient optical coupling, unexpectedly low propagation losses and a broadband sub-50 nm optical confinement. The fabrication in a standard frontline microelectronic facilities hints broad possibilities of hybrid opto-electronic very large scale integration.

5.
Light Sci Appl ; 10(1): 232, 2021 Nov 17.
Artículo en Inglés | MEDLINE | ID: mdl-34785641

RESUMEN

GeSn alloys are promising materials for CMOS-compatible mid-infrared lasers manufacturing. Indeed, Sn alloying and tensile strain can transform them into direct bandgap semiconductors. This growing laser technology however suffers from a number of limitations, such as poor optical confinement, lack of strain, thermal, and defects management, all of which are poorly discussed in the literature. Herein, a specific GeSn-on-insulator (GeSnOI) stack using stressor layers as dielectric optical claddings is demonstrated to be suitable for a monolithically integration of planar Group-IV semiconductor lasers on a versatile photonic platform for the near- and mid-infrared spectral range. Microdisk-shape resonators on mesa structures were fabricated from GeSnOI, after bonding a Ge0.9Sn0.1 alloy layer grown on a Ge strain-relaxed-buffer, itself on a Si(001) substrate. The GeSnOI microdisk mesas exhibited significantly improved optical gain as compared to that of conventional suspended microdisk resonators formed from the as-grown layer. We further show enhanced vertical out-coupling of the disk whispering gallery mode in-plane radiation, with up to 30% vertical out-coupling efficiency. As a result, the GeSnOI approach can be a valuable asset in the development of silicon-based mid-infrared photonics that combine integrated sources in a photonic platform with complex lightwave engineering.

6.
Nat Commun ; 4: 1671, 2013.
Artículo en Inglés | MEDLINE | ID: mdl-23575675

RESUMEN

The development of silicon photonics could greatly benefit from the linear electro-optical properties, absent in bulk silicon, of ferroelectric oxides, as a novel way to seamlessly connect the electrical and optical domain. Of all oxides, barium titanate exhibits one of the largest linear electro-optical coefficients, which has however not yet been explored for thin films on silicon. Here we report on the electro-optical properties of thin barium titanate films epitaxially grown on silicon substrates. We extract a large effective Pockels coefficient of r(eff) = 148 pm V(-1), which is five times larger than in the current standard material for electro-optical devices, lithium niobate. We also reveal the tensor nature of the electro-optical properties, as necessary for properly designing future devices, and furthermore unambiguously demonstrate the presence of ferroelectricity. The integration of electro-optical active films on silicon could pave the way towards power-efficient, ultra-compact integrated devices, such as modulators, tuning elements and bistable switches.

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