Implementation of a Miniaturized Planar Tri-Band Microstrip Patch Antenna for Wireless Sensors in Mobile Applications.

Antennas in wireless sensor networks (WSNs) are characterized by the enhanced capacity of the network, longer range of transmission, better spatial reuse, and lower interference. In this paper, we propose a planar patch antenna for mobile communication applications operating at 1.8, 3.5, and 5.4 GHz. A planar microstrip patch antenna (MPA) consists of two F-shaped resonators that enable operations at 1.8 and 3.5 GHz while operation at 5.4 GHz is achieved when the patch is truncated from the middle. The proposed planar patch is printed on a low-cost FR-4 substrate that is 1.6 mm in thickness. The equivalent circuit model is also designed to validate the reflection coefficient of the proposed antenna with the S11 obtained from the circuit model. It contains three RLC (resistor-inductor-capacitor) circuits for generating three frequency bands for the proposed antenna. Thereby, we obtained a good agreement between simulation and measurement results. The proposed antenna has an elliptically shaped radiation pattern at 1.8 and 3.5 GHz, while the broadside directional pattern is obtained at the 5.4 GHz frequency band. At 1.8, 3.5, and 5.4 GHz, the simulated peak realized gains of 2.34, 5.2, and 1.42 dB are obtained and compared to the experimental peak realized gains of 2.22, 5.18, and 1.38 dB at same frequencies. The results indicate that the proposed planar patch antenna can be utilized for mobile applications such as digital communication systems (DCS), worldwide interoperability for microwave access (WiMAX), and wireless local area networks (WLAN).

MIMO Antenna System for Modern 5G Handheld Devices with Healthcare and High Rate Delivery.

In this work, a new prototype of the eight-element MIMO antenna system for 5G communications, internet of things, and networks has been proposed. This system is based on an H-shaped monopole antenna system that offers 200 MHz bandwidth ranges between 3.4-3.6 GHz, and the isolation between any two elements is well below -12 dB without using any decoupling structure. The proposed system is designed on a commercially available 0.8 mm-thick FR4 substrate. One side of the chassis is used to place the radiating elements, while the copper from the other side is being removed to avoid short-circuiting with other components and devices. This also enables space for other systems, sub-systems, and components. A prototype is fabricated and excellent agreement is observed between the experimental and the computed results. It was found that ECC is 0.2 for any two radiating elements which is consistent with the desirable standards, and channel capacity is 38 bps/Hz which is 2.9 times higher than 4 × 4 MIMO configuration. In addition, single hand mode and dual hand mode analysis are conducted to understand the operation of the system under such operations and to identify losses and/or changes in the key performance parameters. Based on the results, the proposed antenna system will find its applications in modern 5G handheld devices and internet of things with healthcare and high rate delivery. Besides that, its design simplicity will make it applicable for mass production to be used in industrial demands.

Multimode HMSIW-Based Bandpass Filter with Improved Selectivity for Fifth-Generation (5G) RF Front-Ends.

This article presents the detailed theoretical, simulation, and experimental analysis of a half-mode substrate integrated waveguide (HMSIW)-based multimode wideband filter. A third-order, semicircular HMSIW filter is developed in this paper. A semicircular HMSIW cavity resonator is adopted to achieve wide band characteristics. A U-shaped slot (acts as a λ/4 stub) in the center of a semicircular HMSIW cavity resonator and L-shaped open-circuited stubs are used to improve the out-of-band response by generating multiple transmission zeros (TZs) in the stop-band region of the filter. The TZs on either side of the passband can be controlled by adjusting dimensions of a U-shaped slot and L-shaped open-circuited stubs. The proposed filter covers a wide fractional bandwidth, has a lower insertion loss value, and has multiple TZs (which improves the selectivity). The simulated response of filter agrees well with the measured data. The proposed HMSIW bandpass filter can be integrated with any planar wideband communication system circuit, thanks to its planar structure.

Super-Wide Impedance Bandwidth Planar Antenna for Microwave and Millimeter-Wave Applications.

A feasibility study of a novel configuration for a super-wide impedance planar antenna is presented based on a 2 × 2 microstrip patch antenna (MPA) using CST Microwave Studio. The antenna comprises a symmetrical arrangement of four-square patches that are interconnected to each other with cross-shaped high impedance microstrip lines. The antenna array is excited through a single feedline connected to one of the patches. The proposed antenna array configuration overcomes the main drawback of conventional MPA with a narrow bandwidth that is typically <5%. The antenna exhibits a super-wide frequency bandwidth from 20 GHz to 120 GHz for S11 < -15 dB, which corresponds to a fractional bandwidth of 142.85%. The antenna's performance of bandwidth, impedance match, and radiation gain were enhanced by etching slots on the patches. With the inclusion of the slot, the maximum radiation gain and efficiency of the MPA increased to 15.11 dBi and 85.79% at 80 GHz, which showed an improvement of 2.58 dBi and 12.54%, respectively. The dimension of each patch antenna was 4.3 × 5.3 mm2. The results showed that the proposed MPA is useful for various existing and emerging communication systems such as ultra-wideband (UWB) communications, RFID systems, massive multiple-output multiple-input (MIMO) for 5G, and radar systems.

Analysis of gyrobianisotropic media effect on the input impedance, field distribution and mutual coupling of a printed dipole antenna.

In this paper, we present an analytical study for the investigation of the effects of the magnetoelectric elements of a reciprocal and nonreciprocal bianisotropic grounded substrate on the input impedance, resonant length of a dipole antenna as well as on the mutual coupling between two element printed dipole array in three configuration geometries: broadside, collinear and echelon printed on the same material. This study examines also the effect of the considered bianisotropic medium on the electric and magnetic field distributions that has been less addressed in the literature for antenna structures. Computations are based on the numerical resolution, using the spectral method of moments, of the integral equation developed through the mathematical derivation of the appropriate spectral Green's functions of the studied dipole configuration. Original results, for chiral, achiral, Tellegen and general bi-anisotropic media cases, are obtained and discussed with the electric and magnetic field distributions for a better understanding and interpretation. These interesting results can serve as a stepping stone for further works to attract more attention to the reciprocal and non-reciprocal Tellgen media in-depth studies.

An innovative antenna array with high inter element isolation for sub-6 GHz 5G MIMO communication systems.

A novel technique is shown to improve the isolation between radiators in antenna arrays. The proposed technique suppresses the surface-wave propagation and reduces substrate loss thereby enhancing the overall performance of the array. This is achieved without affecting the antenna's footprint. The proposed approach is demonstrated on a four-element array for 5G MIMO applications. Each radiating element in the array is constituted from a 3 × 3 matrix of interconnected resonant elements. The technique involves (1) incorporating matching stubs within the resonant elements, (2) framing each of the four-radiating elements inside a dot-wall, and (3) defecting the ground plane with dielectric slots that are aligned under the dot-walls. Results show that with the proposed approach the impedance bandwidth of the array is increased by 58.82% and the improvement in the average isolation between antennas #1&2, #1&3, #1&4 are 8 dB, 14 dB, 16 dB, and 13 dB, respectively. Moreover, improvement in the antenna gain is 4.2% and the total radiation efficiency is 23.53%. These results confirm the efficacy of the technique. The agreement between the simulated and measured results is excellent. Furthermore, the manufacture of the antenna array using the proposed approach is relatively straightforward and cost effective.

High gain/bandwidth off-chip antenna loaded with metamaterial unit-cell impedance matching circuit for sub-terahertz near-field electronic systems.

An innovative off-chip antenna (OCA) is presented that exhibits high gain and efficiency performance at the terahertz (THz) band and has a wide operational bandwidth. The proposed OCA is implemented on stacked silicon layers and consists of an open circuit meandering line. It is shown that by loading the antenna with an array of subwavelength circular dielectric slots and terminating it with a metamaterial unit cell, its impedance bandwidth is enhanced by a factor of two and its gain on average by about 4 dB. Unlike conventional antennas, where the energy is dissipated in a resistive load, the technique proposed here significantly reduces losses. The antenna is excited from underneath the antenna by coupling RF energy from an open-circuited feedline through a slot in the ground-plane of the middle substrate layer. The feedline is shielded with another substrate layer which has a ground-plane on its opposite surface to mitigate the influence of the structure on which the antenna is mounted. The antenna has the dimensions 12.3 × 4.5 × 0.905 mm3 and operates across the 0.137-0.158 THz band corresponding to a fractional bandwidth of 14.23%. Over this frequency range the average measured gain and efficiency are 8.6 dBi and 77%, respectively. These characteristics makes the proposed antenna suitable for integration in sub-terahertz near-field electronic systems such as radio frequency identification (RFID) devices with high spatial resolution.

Realizing UWB Antenna Array with Dual and Wide Rejection Bands Using Metamaterial and Electromagnetic Bandgaps Techniques.

This research article describes a technique for realizing wideband dual notched functionality in an ultra-wideband (UWB) antenna array based on metamaterial and electromagnetic bandgap (EBG) techniques. For comparison purposes, a reference antenna array was initially designed comprising hexagonal patches that are interconnected to each other. The array was fabricated on standard FR-4 substrate with thickness of 0.8 mm. The reference antenna exhibited an average gain of 1.5 dBi across 5.25-10.1 GHz. To improve the array's impedance bandwidth for application in UWB systems metamaterial (MTM) characteristics were applied it. This involved embedding hexagonal slots in patch and shorting the patch to the ground-plane with metallic via. This essentially transformed the antenna to a composite right/left-handed structure that behaved like series left-handed capacitance and shunt left-handed inductance. The proposed MTM antenna array now operated over a much wider frequency range (2-12 GHz) with average gain of 5 dBi. Notched band functionality was incorporated in the proposed array to eliminate unwanted interference signals from other wireless communications systems that coexist inside the UWB spectrum. This was achieved by introducing electromagnetic bandgap in the array by etching circular slots on the ground-plane that are aligned underneath each patch and interconnecting microstrip-line in the array. The proposed techniques had no effect on the dimensions of the antenna array (20 mm × 20 mm × 0.87 mm). The results presented confirm dual-band rejection at the wireless local area network (WLAN) band (5.15-5.825 GHz) and X-band satellite downlink communication band (7.10-7.76 GHz). Compared to other dual notched band designs previously published the footprint of the proposed technique is smaller and its rejection notches completely cover the bandwidth of interfering signals.

High-isolation antenna array using SIW and realized with a graphene layer for sub-terahertz wireless applications.

This paper presents the results of a study on developing an effective technique to increase the performance characteristics of antenna arrays for sub-THz integrated circuit applications. This is essential to compensate the limited power available from sub-THz sources. Although conventional array structures can provide a solution to enhance the radiation-gain performance however in the case of small-sized array structures the radiation properties can be adversely affected by mutual coupling that exists between the radiating elements. It is demonstrated here the effectiveness of using SIW technology to suppress surface wave propagations and near field mutual coupling effects. Prototype of 2 × 3 antenna arrays were designed and constructed on a polyimide dielectric substrate with thickness of 125 µm for operation across 0.19-0.20 THz. The dimensions of the array were 20 × 13.5 × 0.125 mm3. Metallization of the antenna was coated with 500 nm layer of Graphene. With the proposed technique the isolation between the radiating elements was improved on average by 22.5 dB compared to a reference array antenna with no SIW isolation. The performance of the array was enhanced by transforming the patch to exhibit metamaterial characteristics. This was achieved by embedding the patch antennas in the array with sub-wavelength slots. Compared to the reference array the metamaterial inspired structure exhibits improvement in isolation, radiation gain and efficiency on average by 28 dB, 6.3 dBi, and 34%, respectively. These results show the viability of proposed approach in developing antenna arrays for application in sub-THz integrated circuits.

Optimum power transfer in RF front end systems using adaptive impedance matching technique.

Matching the antenna's impedance to the RF-front-end of a wireless communications system is challenging as the impedance varies with its surround environment. Autonomously matching the antenna to the RF-front-end is therefore essential to optimize power transfer and thereby maintain the antenna's radiation efficiency. This paper presents a theoretical technique for automatically tuning an LC impedance matching network that compensates antenna mismatch presented to the RF-front-end. The proposed technique converges to a matching point without the need of complex mathematical modelling of the system comprising of non-linear control elements. Digital circuitry is used to implement the required matching circuit. Reliable convergence is achieved within the tuning range of the LC-network using control-loops that can independently control the LC impedance. An algorithm based on the proposed technique was used to verify its effectiveness with various antenna loads. Mismatch error of the technique is less than 0.2%. The technique enables speedy convergence (< 5 µs) and is highly accurate for autonomous adaptive antenna matching networks.

Bandwidth and gain enhancement of composite right left handed metamaterial transmission line planar antenna employing a non foster impedance matching circuit board.

The paper demonstrates an effective technique to significantly enhance the bandwidth and radiation gain of an otherwise narrowband composite right/left-handed transmission-line (CRLH-TL) antenna using a non-Foster impedance matching circuit (NF-IMC) without affecting the antenna's stability. This is achieved by using the negative reactance of the NF-IMC to counteract the input capacitance of the antenna. Series capacitance of the CRLH-TL unit-cell is created by etching a dielectric spiral slot inside a rectangular microstrip patch that is grounded through a spiraled microstrip inductance. The overall size of the antenna, including the NF-IMC at its lowest operating frequency is 0.335λ0 × 0.137λ0 × 0.003λ0, where λ0 is the free-space wavelength at 1.4 GHz. The performance of the antenna was verified through actual measurements. The stable bandwidth of the antenna for |S11|≤ - 18 dB is greater than 1 GHz (1.4-2.45 GHz), which is significantly wider than the CRLH-TL antenna without the proposed impedance matching circuit. In addition, with the proposed technique the measured radiation gain and efficiency of the antenna are increased on average by 3.2 dBi and 31.5% over the operating frequency band.

Author Correction: High-Gain Metasurface in Polyimide On-Chip Antenna Based on CRLH-TL for Sub-Terahertz Integrated Circuits.

An amendment to this paper has been published and can be accessed via a link at the top of the paper.

Improved adaptive impedance matching for RF front-end systems of wireless transceivers.

In this paper an automatic adaptive antenna impedance tuning algorithm is presented that is based on quantum inspired genetic optimization technique. The proposed automatic quantum genetic algorithm (AQGA) is used to find the optimum solution for a low-pass passive T-impedance matching LC-network inserted between an RF transceiver and its antenna. Results of the AQGA tuning method are presented for applications across 1.4 to 5 GHz (satellite services, LTE networks, radar systems, and WiFi bands). Compared to existing genetic algorithm-based tuning techniques the proposed algorithm converges much faster to provide a solution. At 1.4, 2.3, 3.4, 4.0, and 5.0 GHz bands the proposed AQGA is on average 75%, 49.2%, 64.9%, 54.7%, and 52.5% faster than conventional genetic algorithms, respectively. The results reveal the proposed AQGA is feasible for real-time application in RF-front-end systems.

Study on improvement of the performance parameters of a novel 0.41-0.47 THz on-chip antenna based on metasurface concept realized on 50 µm GaAs-layer.

A feasibility study is presented on the performance parameters of a novel on-chip antenna based on metasurface technology at terahertz band. The proposed metasurface on-chip antenna is constructed on an electrically thin high-permittivity gallium arsenide (GaAs) substrate layer. Metasurface is implemented by engraving slot-lines on an array of 11 × 11 circular patches fabricated on the top layer of the GaAs substrate and metallic via-holes implemented in the central patch of each row constituting the array, which connects the patch to the leaky-wave open-ended feeding slot-lines running underneath the patches. The slot-lines are connected to each other with a slit. A waveguide port is used to excite the array via slot-lines that couple the electromagnetic energy to the patches. The metasurface on-chip antenna is shown to exhibit an average measured gain in excess of 10 dBi and radiation efficiency above 60% over a wide frequency range from 0.41 to 0.47 THz, which is significant development over other on-chip antenna techniques reported to date. Dimensions of the antenna are 8.6 × 8.6 × 0.0503 mm3. The results show that the proposed GaAs-based metasurface on-chip antenna is viable for applications in terahertz integrated circuits.

High-Gain Metasurface in Polyimide On-Chip Antenna Based on CRLH-TL for Sub-Terahertz Integrated Circuits.

This paper presents a novel on-chip antenna using standard CMOS-technology based on metasurface implemented on two-layers polyimide substrates with a thickness of 500 µm. The aluminium ground-plane with thickness of 3 µm is sandwiched between the two-layers. Concentric dielectric-rings are etched in the ground-plane under the radiation patches implemented on the top-layer. The radiation patches comprise concentric metal-rings that are arranged in a 3 × 3 matrix. The antennas are excited by coupling electromagnetic energy through the gaps of the concentric dielectric-rings in the ground-plane using a microstrip feedline created on the bottom polyimide-layer. The open-ended feedline is split in three-branches that are aligned under the radiation elements to couple the maximum energy. In this structure, the concentric metal-rings essentially act as series left-handed capacitances CL that extend the effective aperture area of the antenna without affecting its dimensions, and the concentric dielectric rings etched in the ground-plane act as shunt left-handed inductors LL, which suppress the surface-waves and reduce the substrates losses that leads to improved bandwidth and radiation properties. The overall structure behaves like a metasurface that is shown to exhibit a very large bandwidth of 0.350-0.385 THz with an average radiation gain and efficiency of 8.15dBi and 65.71%, respectively. It has dimensions of 6 × 6 × 1 mm3 that makes it suitable for on-chip implementation.

S-band hybrid amplifiers based on hydrogenated diamond FETs.

The first realizations of S-band hybrid amplifiers based on hydrogenated-diamond (H-diamond) FETs are reported. As test vehicles of the adopted H-diamond technology at microwave frequencies, two designs are proposed: one, oriented to low-noise amplification, the other, oriented to high-power operation. The two amplifying stages are so devised as to be cascaded into a two-stage amplifier. The activities performed, from the technological steps to characterization, modelling, design and realization are illustrated. Measured performance demonstrates, for the low-noise stage, a noise figure between 7 and 8 dB in the 2-2.5 GHz bandwidth, associated with a transducer gain between 5 and 8 dB. The OIP3 at 2 GHz is 21 dBm. As to the power-oriented stage, its transducer gain is 5-6 dB in the 2-2.5 GHz bandwidth. The 1-dB output compression point at 2 GHz is 20 dBm whereas the OIP3 is 33 dBm. Cascading the measured S-parameters of the two stages yields a transducer gain of 15 ± 1.2 dB in the 2-3 GHz bandwidth.