RESUMEN
Fiber-optic Fabry-Perot pressure sensors based on silicon diaphragms of different thicknesses were fabricated using surface and bulk MEMS techniques in this study. The multi-beam interference resulting from multiple reflecting mirrors with the elastic deformation of the Fabry-Perot sensor was simulated by finite element analysis. The pressure sensitivities of the sensors with different diaphragm thicknesses and the relationship between the pressure and the wavelength shift were simulated. The simulation results were in good agreement with the test results. This study provides guidance for future sensor models and parameter design.
RESUMEN
Silicon-diaphragm-based fiber-optic Fabry-Perot sensors with different intracavity pressures were fabricated by anodic bonding and microelectromechanical techniques. The thermal stress and thermal expansion of the Fabry-Perot (FP) sensor caused by high-temperature bonding and temperature change were simulated by finite-element analysis. The calculated thermal stress is largest in the center and edge regions of the resonance cavity, reaching from 2 to 6 MPa. The reflection spectra and temperature sensitivity of the sensors were simulated by using a two-dimensional wave-optic model in Comsol. Theoretical calculations were also made for the FP cavity without considering silicon-diaphragm deformation and thermal stress. Four sensors with intracavity pressures of 0.01, 0.03, 0.04, and 0.05 MPa were tested at low temperatures, showing a high degree of consistency with the simulation results rather than theoretical calculation, especially for high intracavity pressure. This method is expected to aid the analysis of thermal stress generated during the bonding process and to facilitate better design and control of the temperature sensitivity of the sensor.