Metal-Semiconductor Heterojunction with Ohmic Contact Realizes Efficient Infrared-Light-Driven Photocatalysis.

Efficient utilization of solar energy for photocatalytic applications, particularly in the infrared spectrum, is crucial for addressing environmental challenges and energy scarcity. Herein we present a general strategy for constructing efficient infrared-driven photocatalysts in a metal/semiconductor heterojunction with Ohmic contact, where metals with low work function as the infrared-light absorber and semiconductors with electron storage ability can overcome the unfavorable electron flowback. Taking the NixB/MO2 (M = Ce, Ti, Sn, Ge, Zr, etc.) heterojunction as an example, both experimental and theoretical investigations reveal that the formation of an Ohmic contact facilitates the transfer of hot electrons from NixB to MO2, which are stored by the ion redox pairs for the variable valence character of M. As expected, the heterojunction exhibits remarkable photocatalytic activity under infrared light (λ ≥ 800 nm), as evidenced by the efficient photofixation of CO2 to high-value-added cyclic carbonates. This study offers a general platform for designing infrared-light-driven photocatalysts.

Construction of an Ohmic Contact Cathode by Two Metal Sulfides for efficient Capture and Catalysis of Polysulfide.

The slow reaction kinetics and severe shuttle effect of lithium polysulfide make Li-S battery electrochemical performance difficult to meet the demands of large electronic devices such as electric vehicles. Based on this, an electrocatalyst constructed by metal phase material (MoS2) and semiconductor phase material (SnS2) with ohmic contact is designed for inhibiting the dissolution of lithium polysulfide with improving the reaction kinetics. According to the density-functional theory calculations, it is found that the heterostructured samples with ohmic contacts can effectively reduce the reaction-free energy of lithium polysulfide to accelerate the sulfur redox reaction, in addition to the excellent electron conduction to reduce the overall activation energy. The metallic sulfide can add more sulfophilic sites to promote the capture of polysulfide. Thanks to the ohmic contact design, the carbon nanotube-MoS2-SnS2 achieved a specific capacity of 1437.2 mAh g-1 at 0.1 C current density and 805.5 mAh g-1 after 500 cycles at 1 C current density and is also tested as a pouch cell, which proves to be valuable for practical applications. This work provides a new idea for designing an advanced and efficient polysulfide catalyst based on ohmic contact.

Interfacial Properties of Anisotropic Monolayer SiAs Transistors.

The newly prepared monolayer (ML) SiAs is expected to be a candidate channel material for next-generation nano-electronic devices in virtue of its proper bandgap, high carrier mobility, and anisotropic properties. The interfacial properties in ML SiAs field-effect transistors are comprehensively studied with electrodes (graphene, V2CO2, Au, Ag, and Cu) by using ab initio electronic structure calculations and quantum transport simulation. It is found that ML SiAs forms a weak van der Waals interaction with graphene and V2CO2, while it forms a strong interaction with bulk metals (Au, Ag, and Cu). Although ML SiAs has strong anisotropy, it is not reflected in the contact property. Based on the quantum transport simulation, ML SiAs forms n-type lateral Schottky contact with Au, Ag, and Cu electrodes with the Schottky barrier height (SBH) of 0.28 (0.27), 0.40 (0.47), and 0.45 (0.33) eV along the a (b) direction, respectively, while it forms p-type lateral Schottky contact with a graphene electrode with a SBH of 0.34 (0.28) eV. Fortunately, ML SiAs forms an ideal Ohmic contact with the V2CO2 electrode. This study not only gives a deep understanding of the interfacial properties of ML SiAs with electrodes but also provides a guide for the design of ML SiAs devices.

Reducing the Depletion Region Width at the Anode Interface via a Highly Doped Conjugated Polyelectrolyte Composite for Efficient Organic Solar Cells.

In the realm of organic solar cells (OSCs), the width of the depletion region at the anode interface is a critical factor that adversely impacts the open-circuit voltage (Voc) and the power conversion efficiency (PCE). To address this challenge, a novel approach involving a conjugated polyelectrolyte (CPE)-based composite, PCP-2F-Li:POM, has been developed. This composite serves as a solution-processed hole transport layer (HTL), effectively minimizing the depletion region width in high-performance OSCs. The innovative aspect of PCP-2F-Li:POM lies in its "mutual doping" mechanism. Polyoxometalate (POM) is utilized as a dopant, facilitating the formation of p-doped CPE and n-doped POM within the composite. This results in a substantial increase in doping density, nearly 2 orders of magnitude higher than that observed in unmodified CPE. Consequently, the width of depletion region is markedly reduced, shrinking from 76.4 to 6.0 nm. This reduction plays a pivotal role in enhancing hole transport via the tunneling effect. The practical impact of this development is notable. It leads to an increase in Voc from 0.84 to 0.86 V, thereby contributing significantly to an impressive PCE of 18.04% in OSCs. Moreover, the compatibility of PCP-2F-Li:POM with large-area processing techniques underscores its potential as a viable HTL material for future practical applications. Additionally, its contribution to the enhanced long-term stability of OSCs further bolsters its suitability for practical applications.

Contacts at the Nanoscale and for Nanomaterials.

Contact scaling is a major challenge in nano complementary metal-oxide-semiconductor (CMOS) technology, as the surface roughness, contact size, film thicknesses, and undoped substrate become more problematic as the technology shrinks to the nanometer range. These factors increase the contact resistance and the nonlinearity of the current-voltage characteristics, which could limit the benefits of the further downsizing of CMOS devices. This review discusses issues related to the contact size reduction of nano CMOS technology and the validity of the Schottky junction model at the nanoscale. The difficulties, such as the limited doping level and choices of metal for band alignment, Fermi-level pinning, and van der Waals gap, in achieving transparent ohmic contacts with emerging two-dimensional materials are also examined. Finally, various methods for improving ohmic contacts' characteristics, such as two-dimensional/metal van der Waals contacts and hybrid contacts, junction doping technology, phase and bandgap modification effects, buffer layers, are highlighted.

Sensitivity of ZnO Film-Based X-ray Sensors: A Comprehensive Study on the Effect of Thickness of ZnO Layer.

For all types of photosensors, efficient absorption of photons of particular interest is very essential. We report the effect of thickness of the ZnO layer in ZnO film-based X-ray sensors. A set of five samples Z1, Z2, Z3, Z4, and Z5 is developed by varying the thickness of the ZnO layer between 10 and 73 µm. The dark I-V characteristics of the sensors show a "pseudorectifying" type nature. A quantitative analysis of the dark currents reveals that the dark I-V characteristics are affected by space charge limited current (SCLC) due to intrinsic defects present in the ZnO films. The effect of the SCLC is prominent in the thicker films in comparison to the thinner ones. The sensors show high signal-to-noise (S/N) ratio below 5.0 V bias voltage. The S/N ratio is found to increase with the thickness of the ZnO layer due to efficient absorption of X-ray photons. The photoresponse characteristics of the sensors against dose rate are sublinear between 0.015 and 0.234 Gy/s. The photoresponse time of the sensors are found to be nearly 1 s. The sensitivities of Z1, Z2, Z3, Z4, and Z5 sensors at 4.5 V bias voltage for 0.234 Gy/s dose rate are estimated to be 55.51, 337.08, 312.01, 152.81, and 103.52 µC/Gy cm3, respectively. The sensitivity of the device is found to increase with increase in thickness of the ZnO layer and reaches an optimum level for the thickness of about 19-26 µm. Beyond this range, the sensitivity is found to decrease due to the Schubweg effect.

Contact Engineering of III-Nitrides and Metal Schemes toward Efficient Deep-Ultraviolet Light-Emitting Diodes.

Throughout the development of III-nitride electronic and optoelectronic devices, electrically interfacing III-nitride semiconductors and metal schemes has been a long-standing issue that determines the contact resistance and operation voltage, which are tightly associated with the device performance and stability. Compared to the main research focus of the crystal quality of III-nitride semiconductors, the equally important contact interface between III-nitrides and metal schemes has received relatively less attention. Here, we demonstrate a comprehensive contact engineering strategy to realize low resistance to Al-rich n-AlGaN via pretreatment and metal scheme optimization. Prior to the metal deposition, the introduction of CHF3 treatment is conducive to the substantial resistance reduction, with the effect becoming more distinct by prolonging the treatment time. Furthermore, we compare different metal schemes, namely, Ti/Al/Ti/Au, Ti/Al/Ti/Pt/Au, and Cr/Ti/Al/Ti/Pt/Au, to form electrical contact on n-AlGaN. From microscale analysis based on multiple characterization methods, we reveal the correlation between electrical properties and the nature of the contact interface, attributing the contact improvement to the low-resistance Pt- and Cr-related alloy formation. Under the circumstance that no efforts have been devoted to optimizing the epitaxial growth, engineering the metal-semiconductor contact properties alone leads to a resistance value of 8.96 × 10-5 Ω·cm2. As a result, the fabricated deep-ultraviolet LEDs exhibit an ultralow forward voltage of 5.47 V at 30 A/cm2 and a 33% increase in the peak wall-plug efficiency.

Low-Power Transistors with Ideal p-type Ohmic Contacts Based on VS2/WSe2 van der Waals Heterostructures.

Achieving low-resistance Ohmic contacts with a vanishing Schottky barrier is crucial for enhancing the performance of two-dimensional (2D) field-effect transistors (FETs). In this paper, we present a theoretical investigation of VS2/WSe2-vdWHs-FETs with a gate length (Lg) in the range of 1-5 nm, using ab initio quantum transport simulations. The results show that a very low hole Schottky barrier height (-0.01 eV) can be achieved with perfect band offsets and reduced metal-induced gap states (MIGS), indicating the formation of p-type Ohmic contacts. Additionally, these FETs also exhibit an impressive low subthreshold swing (SS) (69 mV/dec) and high Ion/Ioff (>107) with an appropriate underlap (UL) structure consisting of pristine WSe2. Furthermore, even when the Lg is scaled down to 3 nm, the device can still meet the low-power (LP) requirements of the International Technology Roadmap for Semiconductors (ITRS) by controlling the UL. Consequently, this study provides valuable insights for the future development of LP 2D FETs.