RESUMO
Establishing relationships between the surface atomic structure and activity of Cu-based electrocatalysts for CO2 and CO reduction is hindered by probable surface restructuring under working conditions. Insights into these structural evolutions are scarce as techniques for monitoring the surface facets in conventional experimental designs are lacking. To directly correlate surface reconstructions to changes in selectivity or activity, the development of surface-sensitive, electrochemical probes is highly desirable. Here, we report the underpotential deposition of lead over three low index Cu single crystals in alkaline media, the preferred electrolyte for CO reduction studies. We find that underpotential deposition of Pb onto these facets occurs at distinct potentials, and we use these benchmarks to probe the predominant facet of polycrystalline Cu electrodes in situ. Finally, we demonstrate that Cu and Pb form an irreversible surface alloy during underpotential deposition, which limits this method to investigating the surface atomic structure after reaction.
RESUMO
Being of atomic thickness, graphene is the thinnest imaginable membrane. While graphene's basal plane is highly impermeable at the molecular level, the impermeability is, in practice, compromised by leakage pathways located at the graphene-substrate interface. Here, we provide a kinetic analysis of such interface-mediated leakage by probing gas trapped in graphene-sealed SiO2 cavities versus time and temperature using electron energy loss spectroscopy. The results show that gas leakage exhibits an Arrhenius-type temperature dependency with apparent activation energies between 0.2 and 0.7 eV. Surprisingly, the interface leak rate can be improved by several orders of magnitude by thermal processing, which alters the kinetic parameters of the temperature dependency. The present study thus provides fundamental insight into the leakage mechanism while simultaneously demonstrating thermal processing as a generic approach for tightening graphene-based-seals with applications within chemistry and biology.
RESUMO
A critical step toward the systematic development of electrocatalysts is the determination of the microscopic structure and processes at the electrified solid/electrolyte interface. The major challenges toward this end for experiment and computations are achieving sufficient cleanliness and modeling the complexity of electrochemical systems, respectively. In this sense, benchmarks of well-defined model systems are sparse. This work presents a rigorous joint experimental-theoretical study on the single-crystal (SC) Cu/aqueous interface. Within typical computational uncertainties, we find quantitative agreement between simulated and experimentally measured voltammograms, which allows us to unequivocally identify the *OH adsorption feature in the fingerprint region of Cu(110), Cu(100), and Cu(111) SCs under alkaline conditions. We find the inclusion of hydrogen evolution reaction kinetics in the theoretical model to be crucial for an accurate steady-state description that gives rise to a negligible H* coverage. A purely thermodynamic description of the H* coverage through a Pourbaix analysis would incorrectly lead to a H* adsorption peak. The presented results establish a fundamental benchmark for all electrochemical applications of Cu.