High-absorption optical stack for aluminum kinetic inductance detectors.

We present a high-absorption optical stack design for aluminum (Al) kinetic inductance detectors (KIDs). Aluminum can be easily processed in micro-fabrication and is the most conventional superconducting material for KIDs. However, it is challenging to achieve high absorption in the Al absorber because of its high reflection at optical wavelengths. By embedding the thin Al film between an anti-reflection (AR) coating layer and a dielectric-based distributed Bragg reflector, we show that close-to-unity absorption can be achieved around a single wavelength (e.g., ≈98.9% at 1518 nm). The reflection and transmission measurements agree well with the calculation based on the transmission matrix model. We also show our preliminary results of absorption ≥70% in a broader wavelength range (≈230n m) with multilayer AR coatings. The absorber design in a lumped-element KID is discussed. Our work paves the way to high-efficiency photon-counting and energy-resolving Al-based KIDs in the optical to NIR range.

Robust ultrahigh electromagnetic interference shielding effectiveness based on engineered structures of carbon nanotube films.

High-performance electromagnetic interference (EMI) shielding materials with ultrathin, flexible, and pliable mechanical properties are highly desired for high-end equipments, yet there remain large challenges in the manufacture of these materials. Here, carbon nanotube film (CNTF)/copper (Cu) nanoparticle (NP) composite films are fabricated via a facile electrodeposition method to achieve high electromagnetic shielding efficiency. Notably, a CNTF/Cu NP composite film with 15 µm thickness can achieve excellent EMI shielding efficiency of ∼248 dB and absolute EMI shielding effectiveness as high as 2.17 × 105 dB cm2 g-1, which are the best values for composite EMI shielding materials with similar or greater thicknesses. These engineered composite films exhibit excellent deformation tolerance, which ensures the robust reliability of EMI shielding efficiency after 20,000 cycles of repeated bending. Our results represent a critical breakthrough in the preparation of ultrathin, flexible, and pliable shielding films for applications in smart, portable and wearable electronic devices, and 5G communication.