Efficient four-way vertical coupler array for chip-scale space-division-multiplexing applications.

We propose and demonstrate a three-dimensional nano-printed four-channel vertical coupler array on the silicon-on-insulator platform for efficient chip-to-multicore fiber coupling. The proposed structure provides less than 1 dB loss in a single lane and around 2-4 dB loss in multicore fiber coupling, over 100 nm 1 dB bandwidth, and large 1 dB misalignment tolerances of more than 5 µm in the xy plane and 20 µm in the z direction. The device shows great promise for photonic integrated devices for space-division-multiplexing technology based on multicore fiber.

Low-loss and broadband fiber-to-chip coupler by 3D fabrication on a silicon photonic platform.

We propose and demonstrate a low-loss fiber-to-chip vertical coupler on the silicon photonic platform by using a 3D two-photon fabrication method. Such a coupler significantly reduces insertion loss, measured to be 1 dB, and provides a wide working wavelength range for both TE and TM polarizations over the entire C-band. Moreover, a large tolerance for misalignment of the coupling fiber, up to 4.5 µm for a 1 dB loss, enables the development of relaxed alignment techniques.