Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment.

During the last years, intense pulsed light (IPL) processing has been employed and studied intensively for the drying and sintering of metal nanoparticle layers deposited by means of printing methods on flexible polymer substrates. IPL was found to be a very fast and substrate-gentle approach qualified for the field of flexible and large-area printed electronics, i.e. manufactured via roll-to-roll processing. In this contribution, IPL is used for the fine-patterning of printed silver nanoparticle layers. The patterning is obtained by induced and controlled crack formation in the thin silver layer due to the intense exposure of IPL. The crack formation is controlled by selection of the substrate material, the fine-tuning of the morphology of the silver layer and an application of a dielectric layer on top of the silver layer that acts as a stress concentrator. Careful optimization of the IPL parameters allowed to adjust the lateral width of the crack. This novel approach turned out to be a fast and reproducible high-resolution patterning process for multiple applications, e.g. to pattern the source-drain electrodes for all-inkjet-printed thin-film transistors.

Manufacturing of All Inkjet-Printed Organic Photovoltaic Cell Arrays and Evaluating their Suitability for Flexible Electronics.

The generation of electrical energy depending on renewable sources is rapidly growing and gaining serious attention due to its green sustainability. With fewer adverse impacts on the environment, the sun is considered as a nearly infinite source of renewable energy in the production of electrical energy using photovoltaic devices. On the other end, organic photovoltaic (OPV) is the class of solar cells that offers several advantages such as mechanical flexibility, solution processability, environmental friendliness, and being lightweight. In this research, we demonstrate the manufacturing route for printed OPV device arrays based on conventional architecture and using inkjet printing technology over an industrial platform. Inkjet technology is presently considered to be one of the most matured digital manufacturing technologies because it offers inherent additive nature and last stage customization flexibility (if the main goal is to obtain custom design devices). In this research paper, commercially available electronically functional inks were carefully selected and then implemented to show the importance of compatibility between OPV material stacks and the device architecture. One of the main outcomes of this work is that the manufacturing of the OPV devices was accomplished using inkjet technology in massive numbers ranging up to 1500 containing different device sizes, all of which were deposited on a flexible polymeric film and under normal atmospheric conditions. In this investigation, it was found that with a set of correct functional materials and architecture, a manufacturing yield of more than 85% could be accomplished, which would reflect high manufacturing repeatability, deposition accuracy, and processability of the inkjet technology.

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis.

We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement.