RESUMO
Thin films of ferroelectric materials are potential candidates to be implemented in the unfolding of a new paradigm in high-density memory devices. As the thickness of these films reaches the sub-10 nm level, the interface properties between the electrode and ferroelectric material undergo significant changes that play a crucial role in governing the ferroelectric behavior. The present state-of-the-art approach presents a detailed investigation of different high pressure annealing (HPA) conditions through simulation studies. The simulation studies were performed using Landau-Khalatnikov equations, with Landau's parameters calculated using the least regression method as described in the Method S1. The extracted coefficients were used to determine various relationships (free energy, ferroelectric potential and negative capacitance) with which to observe the impact of HPA on the negative capacitance (NC) effect on account of the majority ferroelectric phase. To verify the simulation results, pulse transient switching measurements were conducted using Pt/Ti/TiN/Hf0.5Zr0.5O2/TiN-based metal-ferroelectric-metal (MFM) devices to study the coercive field, interfacial capacitance and load resistance behavior. The results suggest that the non-ferroelectric portion (t-phase) coexists with the ferroelectric (o-phase) within the thin layer of the MFM capacitor adjacent to TiN electrode, which undergoes a phase transformation from the t-phase to the o-phase when exposed to different HPA conditions as well as electric field cycling during PS measurements. The simulation and experimental results confirm that the 550 °C at 50 atm N2 environment provides the best possibility of achieving the highest ferroelectric characteristics with the lowest proportion of the non-ferroelectric phase and thus the maximum NC effect as well.
RESUMO
Top gate a-InGaZnO (IGZO) thin-film transistors (TFTs) annealed at high temperature show excellent initial current-voltage (I-V) characteristics. However, when they are exposed to positive gate bias for a long time, hump can occur in the subthreshold region. This abnormal hump is accelerated at a higher positive gate voltage and mitigate by a negative gate voltage. While the strength of the hump is irrelevant to a change in channel width, it relies significantly on channel length. This phenomenon might be due to mobile Na ions diffused from a glass substrate migrating toward the back and edge side of the IGZO semiconductor by a vertical gate electric field. When a layer of Al2O3 is formed between the IGZO semiconductor and the glass substrate, the hump phenomenon could be successfully solved by serving as a barrier for Na ions moving into the IGZO.
RESUMO
The effect of the channel interface of top-gate InGaZnO (IGZO) thin film transistors (TFTs) on the electrical properties caused by exposure to various wet chemicals such as deionized water, photoresist (PR), and strippers during the photolithography process was studied. Contrary to the good electrical characteristics of TFTs including a protective layer (PL) to avoid interface damage by wet chemical processes, TFTs without PL showed a conductive behavior with a negative threshold voltage shift, in which the ratio of Ga and Zn on the IGZO top surface reduced due to exposure to a stripper. In addition, the wet process in photolithography increased oxygen vacancy and oxygen impurity on the IGZO surface. The photo-patterning process increased donor-like defects in IGZO due to organic contamination on the IGZO surface by PR, making the TFT characteristics more conductive. The introduction of ozone (O3) annealing after photo-patterning and stripping of IGZO reduced the increased defect states on the surface of IGZO due to the wet process and effectively eliminated organic contamination by PR. In particular, by controlling surface oxygens on top of the IGZO surface excessively generated with O3 annealing using UV irradiation of 185 and 254 nm, IGZO TFTs with excellent current-voltage characteristics and reliability could be realized comparable to IGZO TFTs containing PL.
RESUMO
Flexible displays on a polyimide (PI) substrate are widely regarded as a promising next-generation display technology due to their versatility in various applications. Among other bendable materials used as display panel substrates, PI is especially suitable for flexible displays for its high glass transition temperature and low coefficient of thermal expansion. PI cured under various temperatures (260 °C, 360 °C, and 460 °C) was implemented in metal-insulator-metal (MIM) capacitors, amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFT), and actual display panels to analyze device stability and panel product characteristics. Through electrical analysis of the MIM capacitor, it was confirmed that the charging effect in the PI substrates intensified as the PI curing temperature increased. The threshold voltage shift (ΔVth) of the samples was found to increase with rising curing temperature under negative bias temperature stress (NBTS) due to the charging effect. Our analyses also show that increasing ΔVth exacerbates the image sticking phenomenon observed in display panels. These findings ultimately present a direct correlation between the curing temperature of polyimide substrates and the panel image sticking phenomenon, which could provide an insight into the improvement of future PI-substrate-based displays.
RESUMO
The concentration of TiO(2) in a cream formulation has been non-destructively measured using Raman spectroscopy without further sample pretreatments. The distribution of TiO(2) particles in a highly viscous cream may not be homogeneous on a microscopic scale and local aggregation of the particles is possible; therefore, acquisition of Raman spectra capable of representing the whole sample identity rather than the localized chemical information was critically necessary to ensure reliable quantitative analysis. A wide area illumination (WAI) scheme, applying 6-mm diameter laser illumination area (total coverage: 28.3mm(2)) on a sample, was used to achieve representative sample presentation and improved accuracy. When Raman spectra were collected for the same sample using a conventional scheme with a much smaller laser spot ( approximately 100 microm), the spectral reproducibility was degraded, as expected. The local aggregation of TiO(2) particles was confirmed by analyzing both SEM (scanning electron microscopy) and Raman images of a cream sample. When the WAI scheme was used, the resulting error in the determination of TiO(2) concentration was 0.03 wt%, while 0.17 wt% in the case of using the conventional scheme. The proposed Raman scheme would be advantageous over the conventional titration method that requires destructive incineration of the organic cream matrix, as well as a large consumption of chemical reagents.