RESUMO
The electrical characteristics of SiC nanocrystal nonvolatile-memory devices with variable oxide and crested tunnel barriers consisting of a SiO2/Si3N4/SiO2 (ONO) and a Si3N4/SiO2/Si3N4 (NON) layer, respectively, were investigated. The equivalent oxide thickness of the ONO and NON tunnel barriers were about 5.6 nm and 5.2 nm, respectively. When the +/- 13 V bias voltage was applied for 500 ms, the threshold voltage shifts of the SiC-nanocrystal-embedded memory devices with ONO and NON tunnel barriers were about 2.4 V. The operation speeds of the memories with ONO and NON tunnel barriers under the +/- 10 V applied pulse bias were approximately 5 and 20 ms, respectively. The field sensitivity of the ONO tunnel barrier was higher than that of the NON tunnel barrier during electron injection. The tunneling efficiency during the programming/erasing processes could be improved by the engineered tunnel barrier layer. Therefore, the SiC-nanocrystal-embedded memory device with an ONO tunnel barrier can be applied to nonvolatile-memory devices.
RESUMO
WSi2 nanocrystal nonvolatile memory devices were fabricated with a silicon oxide-nitride-oxide (SiO2: 2 nm/Si3N4:2 nm/SiO2:3 nm) tunnel layer. WSi2 nanocrystals of 2.5 nm diameters and a density of 3.6 x 10(12) cm(-2) were formed using radio frequency magnetron sputtering and annealing processes. The WSi2 nanocrystal nonvolatile memory device exhibited strong thermal stability during writing/erasing operations at temperatures up to 125 degrees C. When the writing/erasing voltages were applied at +10 V/-10 V for 500 ms, the memory window of the initial approximately 2.6 V decreased by approximately 1.1 V at 25 degrees C and 0.4 V at 125 degrees C after 10(4) sec, respectively. These results show that WSi2 nanocrystals with barrier-engineered tunnel layers are possible for application in nonvolatile memory devices.