RESUMO
The surface structure effect on the oxidation of Cu has been investigated by performing ambient-pressure X-ray photoelectron spectroscopy (APXPS) on Cu(111) and Cu(110) surfaces under oxygen pressures ranging from 10-8 to 1â mbar and temperatures from 300 to 750â K. The APXPS results show a subsequential phase transition from chemisorbed O/Cu overlayer to Cu2 O and then to CuO on both surfaces. For a given temperature, the oxygen pressure needed to induce initial formation of Cu2 O on Cu(110) is about two orders of magnitude greater than that on Cu(111), which is in contrast with the facile formation of O/Cu overlayer on clean Cu(110). The depth profile measurements during the initial stage of Cu2 O formation indicate the distinct growth modes of Cu2 O on the two surface orientations. We attribute these prominent effects of surface structure to the disparities in the kinetic processes, such as the dissociation and surface/bulk diffusion over O/Cu overlayers. Our findings provide new insights into the kinetics-controlled process of Cu oxidation by oxygen.
RESUMO
The distribution of facet types affects the functionality of the surfaces of polycrystalline films. However, we are not aware of a previously published convenient method to determine their distribution. This work describes and demonstrates a process to determine and map the Miller indexes (hkl) of crystal facets exposed at the surfaces of polycrystalline films. To find facet types in non-trivial cases, one must know the orientation of the crystal and the direction in which the facet is facing. The method presented here combines the crystal orientations obtained with electron backscatter diffraction with the topography of the same sample area measured with atomic force microscopy. A challenging step is to transfer the data from the two instruments into a common coordinate system. The sequence of steps in the data processing is presented, with methods to verify the results. The process is illustrated with the analysis of an etched copper clad laminate (CCL) and an electroless Cu film deposited on the CCL. This example relates to facet selection in electroless and galvanic plating processes in printed circuit board production, where an uncontrolled transition from epitaxial to non-epitaxial growth can lead to surfaces with unacceptable roughness.
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We investigated the ability of Luminore CopperTouch copper and copper-nickel surfaces to inactivate filoviruses and severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2). The copper and copper-nickel surfaces inactivated 99.9% of Ebola and Marburg viruses after 30 min, and the copper surfaces inactivated 99% of SARS-CoV-2 in 2 h. These data reveal that Ebola virus, Marburg virus, and SARS-CoV-2 are inactivated by exposure to copper ions, validating Luminore CopperTouch as an efficacious tool for infection control.
Assuntos
COVID-19 , Ebolavirus , Doença pelo Vírus Ebola , Marburgvirus , Doença pelo Vírus Ebola/tratamento farmacológico , Doença pelo Vírus Ebola/prevenção & controle , Humanos , SARS-CoV-2RESUMO
The growth of carbon layers, defective graphene, and graphene by deposition of polycyclic aromatic hydrocarbons (PAHs) on Cu(111) is studied by scanning tunneling microscopy and X-ray photoelectron spectroscopy. Two different PAHs are used as starting materials: the buckybowl pentaindenocorannulene (PIC) which contains pentagonal rings and planar coronene (CR). For both precursors, with increasing sample temperature during deposition, porous carbon aggregates (350 °C), dense carbon layers (400-450 °C), disordered defective graphene (500 °C-550 °C), and extended graphene (≥600 °C) are obtained. No significant differences for defective graphene grown from PIC and CR are observed. C 1s X-ray photoelectron spectra of PIC and CR derived samples grown at 350-550 °C exhibit a characteristic C-Cu low binding energy component. Preparation at ≥600 °C eliminates this C-Cu species and only C-C bonded carbon remains.
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In this paper, the effects of carbon nanotube defects and a copper surface oxide layer on a carbon nanotube-copper interface were studied via first-principles. A defect-free CNT-Cu interface, Stone-Wales defect CNT-Cu interface, single-hole and double-hole defect CNT-Cu interface, and Cu2O-Cu interface were simulated and calculated. By simulating the differential charge density, atomic population, bond population and density of states of the interface model, the effects of various defects on the interface bonding and electrical conductivity of the composites during the preparation of the CNT-reinforced copper matrix composites were analyzed, which provided theoretical guidance for the preparation of CNT/Cu composites. After that, copper matrix composites with different CNT defect contents were prepared via different rolling deformation processes. Their hardness and electrical conductivity were tested, and the results were consistent with the results obtained via the first-principles calculations.
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The present work aimed to explore molecular insight into the tetrahydrofuran (THF) hydrate growth along its crystallographic face to consider the heterogeneous conditions. Molecular dynamic (MD) simulation results provided detailed dynamical aspects of water, and THF molecules at the interface of aqueous solution/hydrate slab by using the F3 order parameter, and visual snapshots of the system at different times. Our simulations revealed that the interfacial properties of the hydrate phase can change the local structure of water molecules in the liquid phase and thus alter the kinetics of hydrate formation. Furthermore, the behavior of THF solution on the copper surface under the hydrate-forming conditions has been studied. It was found that the copper surface affected the THF solution by changing the distribution of THF and water molecules near the liquid-solid interface. Also, the MD simulation showed that a layer of THF molecules was adsorbed on the copper surface and subsequently, a dense water film was formed resulting in a strong resistance to order the water molecules around the THF for hydrate formation. These results are illustrative of how interfacial properties can affect the heterogeneous crystal growth of the hydrate phase.
RESUMO
We calculated the adsorption of H, O, OH, and H2O and the dissociation of H2O molecule on the Cu(111), Cu(100), and Cu(110) surfaces using density functional theory. H, O, and OH tend to adsorb stably at the highly coordinated dh and h sites on the Cu(111) and Cu(100) surfaces. OH and H tend to adsorb on sb site on the Cu(110) surface. The more charge transfer of the adsorbed substance, the more stable the adsorption. The dissociation product is O+H on the Cu(111) surface, while the dissociation product is OH+H on the Cu(100) and Cu(110) surfaces. Due to the different geometric structures of initial state (IS), transition state (TS), and final state (FS) in the dissociation reaction, the dissociation of water on the copper surface does not establish a linear Brønsted-Evans-Polanyi (BEP) relationship. These results provide theoretical support for the understanding of the interaction between water and metals as well as the behavior of water molecules.
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This study explores the role of membrane phospholipid peroxidation in the copper alloy mediated contact killing of Bacillus subtilis, a spore-forming gram-positive bacterial species. We found that B. subtilis endospores exhibited significant resistance to copper alloy surface killing but vegetative cells were highly sensitive to copper surface exposure. Cell death and lipid peroxidation occurred in B. subtilis upon copper alloy surface exposure. In a sporulation-defective strain carrying a deletion of almost the entire SpoIIA operon, lipid peroxidation directly correlated with cell death. Moreover, killing and lipid peroxidation initiated immediately and at a constant rate upon exposure to the copper surface without the delay observed previously in E. coli. These findings support the hypothesis that membrane lipid peroxidation is the initiating event causing copper surface induced cell death of B. subtilis vegetative cells. The findings suggest that the observed differences in the kinetics of copper-induced killing compared to E. coli result from differences in cell envelop structure. As demonstrated in E. coli, DNA degradation was shown to be a secondary effect of copper exposure in a B. subtilis sporulation-defective strain.