Your browser doesn't support javascript.
loading
Skin-integrated wireless haptic interfaces for virtual and augmented reality.
Yu, Xinge; Xie, Zhaoqian; Yu, Yang; Lee, Jungyup; Vazquez-Guardado, Abraham; Luan, Haiwen; Ruban, Jasper; Ning, Xin; Akhtar, Aadeel; Li, Dengfeng; Ji, Bowen; Liu, Yiming; Sun, Rujie; Cao, Jingyue; Huo, Qingze; Zhong, Yishan; Lee, ChanMi; Kim, SeungYeop; Gutruf, Philipp; Zhang, Changxing; Xue, Yeguang; Guo, Qinglei; Chempakasseril, Aditya; Tian, Peilin; Lu, Wei; Jeong, JiYoon; Yu, YongJoon; Cornman, Jesse; Tan, CheeSim; Kim, BongHoon; Lee, KunHyuk; Feng, Xue; Huang, Yonggang; Rogers, John A.
  • Yu X; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Xie Z; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Yu Y; Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
  • Lee J; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Vazquez-Guardado A; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Luan H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Ruban J; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Ning X; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Akhtar A; School of Materials Science and Engineering, Tsinghua University, Beijing, China.
  • Li D; NeuroLux Corporation, Evanston, IL, USA.
  • Ji B; Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Liu Y; Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Sun R; NeuroLux Corporation, Evanston, IL, USA.
  • Cao J; Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA.
  • Huo Q; PSYONIC, Inc., Champaign, IL, USA.
  • Zhong Y; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Lee C; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Kim S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Gutruf P; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Zhang C; Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China.
  • Xue Y; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Guo Q; Bristol Composites Institute, University of Bristol, Bristol, UK.
  • Chempakasseril A; Wearifi, Inc., Evanston, IL, USA.
  • Tian P; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Lu W; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Jeong J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Yu Y; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Cornman J; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Tan C; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Kim B; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Lee K; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Feng X; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Huang Y; Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA.
  • Rogers JA; AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
Nature ; 575(7783): 473-479, 2019 11.
Article en En | MEDLINE | ID: mdl-31748722
ABSTRACT
Traditional technologies for virtual reality (VR) and augmented reality (AR) create human experiences through visual and auditory stimuli that replicate sensations associated with the physical world. The most widespread VR and AR systems use head-mounted displays, accelerometers and loudspeakers as the basis for three-dimensional, computer-generated environments that can exist in isolation or as overlays on actual scenery. In comparison to the eyes and the ears, the skin is a relatively underexplored sensory interface for VR and AR technology that could, nevertheless, greatly enhance experiences at a qualitative level, with direct relevance in areas such as communications, entertainment and medicine1,2. Here we present a wireless, battery-free platform of electronic systems and haptic (that is, touch-based) interfaces capable of softly laminating onto the curved surfaces of the skin to communicate information via spatio-temporally programmable patterns of localized mechanical vibrations. We describe the materials, device structures, power delivery strategies and communication schemes that serve as the foundations for such platforms. The resulting technology creates many opportunities for use where the skin provides an electronically programmable communication and sensory input channel to the body, as demonstrated through applications in social media and personal engagement, prosthetic control and feedback, and gaming and entertainment.
Asunto(s)

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Piel / Tacto / Interfaz Usuario-Computador / Diseño de Equipo / Tecnología Inalámbrica / Realidad Virtual / Realidad Aumentada Tipo de estudio: Qualitative_research Límite: Female / Humans / Male Idioma: En Año: 2019 Tipo del documento: Article

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Piel / Tacto / Interfaz Usuario-Computador / Diseño de Equipo / Tecnología Inalámbrica / Realidad Virtual / Realidad Aumentada Tipo de estudio: Qualitative_research Límite: Female / Humans / Male Idioma: En Año: 2019 Tipo del documento: Article