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Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging.
Wang, Pao-Hsiung; Huang, Yu-Wei; Chiang, Kuo-Ning.
  • Wang PH; Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan.
  • Huang YW; Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan.
  • Chiang KN; Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan.
Micromachines (Basel) ; 12(3)2021 Mar 10.
Article en En | MEDLINE | ID: mdl-33802243
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Texto completo: 1 Banco de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Año: 2021 Tipo del documento: Article
Texto completo
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XML
PubMed Links
Search on Google

Texto completo: 1 Banco de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Año: 2021 Tipo del documento: Article