Wafer-Bonding Fabricated CMUT Device with Parylene Coating.

He, Changde; Zhang, Binzhen; Xue, Chenyang; Zhang, Wendong; Zhang, Shengdong.

He C; School of Electronic and Computer Engineering, Peking University, Shenzhen 518055, China.
Zhang B; Institute of Microelectronics, Peking University, Beijing 100871, China.
Xue C; State Key Laboratory of Dynamic Testing Technology, North University of China, Taiyuan 030051, China.
Zhang W; State Key Laboratory of Dynamic Testing Technology, North University of China, Taiyuan 030051, China.
Zhang S; State Key Laboratory of Dynamic Testing Technology, North University of China, Taiyuan 030051, China.

Micromachines (Basel) ; 12(5)2021 May 04.

Article en En | MEDLINE | ID: mdl-34064449