Low-Temperature Co-hydroxylated Cu/SiO<sub>2</sub> Hybrid Bonding Strategy for a Memory-Centric Chip Architecture.

Low-Temperature Co-hydroxylated Cu/SiO₂ Hybrid Bonding Strategy for a Memory-Centric Chip Architecture.

Kang, Qiushi; Wang, Chenxi; Zhou, Shicheng; Li, Ge; Lu, Tian; Tian, Yanhong; He, Peng.

Kang Q; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Wang C; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Zhou S; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Li G; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Lu T; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Tian Y; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
He P; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.

ACS Appl Mater Interfaces ; 13(32): 38866-38876, 2021 Aug 18.

Article en En | MEDLINE | ID: mdl-34318673