Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics.

Sheng, Aaron; Khuje, Saurabh; Yu, Jian; Petit, Donald; Parker, Thomas; Zhuang, Cheng-Gang; Kester, Lanrik; Ren, Shenqiang.

Sheng A; Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States.
Khuje S; Department of Mechanical and Aerospace Engineering, Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States.
Yu J; Army Research Laboratory, Aberdeen Proving Ground, Maryland 21005, United States.
Petit D; Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States.
Parker T; Army Research Laboratory, Aberdeen Proving Ground, Maryland 21005, United States.
Zhuang CG; Corning Research and Development Corporation, New York 14830, United States.
Kester L; Corning Research and Development Corporation, New York 14830, United States.
Ren S; Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States.

Nano Lett ; 21(21): 9279-9284, 2021 Nov 10.

Article en En | MEDLINE | ID: mdl-34709842